Part Details for MC68360CFE25 by NXP Semiconductors
Overview of MC68360CFE25 by NXP Semiconductors
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Part Details for MC68360CFE25
MC68360CFE25 CAD Models
MC68360CFE25 Part Data Attributes
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MC68360CFE25
NXP Semiconductors
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Datasheet
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MC68360CFE25
NXP Semiconductors
RISC Microcontroller
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Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | FQFP, | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO OPERATES AT 5 V SUPPLY | |
Address Bus Width | 32 | |
Boundary Scan | YES | |
Bus Compatibility | 68000 | |
Clock Frequency-Max | 25 MHz | |
Communication Protocol | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | |
Data Encoding/Decoding Method | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL | |
Data Transfer Rate-Max | 10 MBps | |
External Data Bus Width | 32 | |
JESD-30 Code | S-CQFP-G240 | |
Length | 31.305 mm | |
Low Power Mode | YES | |
Number of DMA Channels | 2 | |
Number of I/O Lines | 46 | |
Number of Serial I/Os | 4 | |
Number of Terminals | 240 | |
On Chip Data RAM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP240,1.3SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
RAM (words) | 2560 | |
Seated Height-Max | 4.15 mm | |
Supply Current-Max | 250 mA | |
Supply Voltage-Max | 3.3 V | |
Supply Voltage-Min | 2.7 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 31.305 mm | |
uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |