Part Details for MCK68HC16Z1VFC25 by NXP Semiconductors
Overview of MCK68HC16Z1VFC25 by NXP Semiconductors
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MCK68HC16Z1VFC25
MCK68HC16Z1VFC25 CAD Models
MCK68HC16Z1VFC25 Part Data Attributes
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MCK68HC16Z1VFC25
NXP Semiconductors
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MCK68HC16Z1VFC25
NXP Semiconductors
16-BIT, 25.17MHz, MICROCONTROLLER, PQFP132
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Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | PLASTIC, QFP-132 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | NO | |
Address Bus Width | 24 | |
Bit Size | 16 | |
CPU Family | 6816 | |
Clock Frequency-Max | 5.2 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | 16 | |
JESD-30 Code | S-PQFP-G132 | |
Length | 24.13 mm | |
Number of I/O Lines | 37 | |
Number of Terminals | 132 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BQFP | |
Package Equivalence Code | SPQFP132,1.1SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, BUMPER | |
Qualification Status | Not Qualified | |
RAM (bytes) | 1024 | |
Seated Height-Max | 4.572 mm | |
Speed | 25.17 MHz | |
Supply Current-Max | 110 mA | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | HCMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.635 mm | |
Terminal Position | QUAD | |
Width | 24.13 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |