Part Details for MCM63R818FC3 by NXP Semiconductors
Overview of MCM63R818FC3 by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for MCM63R818FC3
MCM63R818FC3 CAD Models
MCM63R818FC3 Part Data Attributes
|
MCM63R818FC3
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
MCM63R818FC3
NXP Semiconductors
Late-Write SRAM
|
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | BGA, | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 1.5 ns | |
JESD-30 Code | R-PBGA-B119 | |
Length | 22 mm | |
Memory Density | 4718592 bit | |
Memory IC Type | LATE-WRITE SRAM | |
Memory Width | 18 | |
Number of Functions | 1 | |
Number of Terminals | 119 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX18 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Seated Height-Max | 2.77 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.375 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm |