Part Details for MCM68764C-35 by Motorola Mobility LLC
Overview of MCM68764C-35 by Motorola Mobility LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Part Details for MCM68764C-35
MCM68764C-35 CAD Models
MCM68764C-35 Part Data Attributes
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MCM68764C-35
Motorola Mobility LLC
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Datasheet
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MCM68764C-35
Motorola Mobility LLC
8K X 8 UVPROM, 350 ns, CDIP24, FRIT SEALED, CERAMIC, DIP-24
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MOTOROLA INC | |
Part Package Code | DIP | |
Package Description | WDIP, | |
Pin Count | 24 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 350 ns | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Length | 32.005 mm | |
Memory Density | 65536 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.84 mm | |
Supply Current-Max | 0.085 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | NMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15.24 mm |
Alternate Parts for MCM68764C-35
This table gives cross-reference parts and alternative options found for MCM68764C-35. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MCM68764C-35, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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PY26345PMB | UVPROM, 8KX8, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Pyramid Semiconductor Corporation | MCM68764C-35 vs PY26345PMB |
5962-8751504LX | 8KX8 UVPROM, 90ns, CDIP24, CERAMIC, DIP-24 | STMicroelectronics | MCM68764C-35 vs 5962-8751504LX |
5962-8751509LA | UVPROM, 8KX8, 45ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | Cypress Semiconductor | MCM68764C-35 vs 5962-8751509LA |
5962-8751503LA | 8KX8 UVPROM, 70ns, CDIP24, 0.300 INCH, CERDIP-24 | STMicroelectronics | MCM68764C-35 vs 5962-8751503LA |
CY7C263-35WI | UVPROM, 8KX8, 35ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, SLIM, CERDIP-24 | Cypress Semiconductor | MCM68764C-35 vs CY7C263-35WI |
PY26455WM | UVPROM, 8KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24 | Pyramid Semiconductor Corporation | MCM68764C-35 vs PY26455WM |
LH5749J-70 | UVPROM, 8KX8, 70ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-24 | Sharp Corp | MCM68764C-35 vs LH5749J-70 |
5962-8751511LB | UVPROM, 8KX8, 25ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | Cypress Semiconductor | MCM68764C-35 vs 5962-8751511LB |
5962-8751512LA | UVPROM, 8KX8, 25ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | Cypress Semiconductor | MCM68764C-35 vs 5962-8751512LA |
UPD27HC65DX-45 | UVPROM, 8KX8, 45ns, CMOS, CDIP24, WINDOWED, CERDIP-24 | NEC Electronics Group | MCM68764C-35 vs UPD27HC65DX-45 |