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Overview of MIC2782ELYCSTR by Microchip Technology Inc
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for MIC2782ELYCSTR by Microchip Technology Inc
Part Data Attributes for MIC2782ELYCSTR by Microchip Technology Inc
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Rohs Code
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Yes
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Part Life Cycle Code
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Active
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Ihs Manufacturer
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MICREL INC
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Package Description
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FBGA, BGA6,2X3,16
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Reach Compliance Code
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compliant
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JESD-30 Code
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R-PBGA-B6
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Number of Terminals
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6
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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FBGA
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Package Equivalence Code
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BGA6,2X3,16
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, FINE PITCH
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Power Supplies
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3.3 V
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Qualification Status
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Not Qualified
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Supply Current-Max (Isup)
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0.005 mA
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Supply Voltage-Nom (Vsup)
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3.3 V
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Surface Mount
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YES
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Terminal Form
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BALL
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Terminal Pitch
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0.4 mm
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Terminal Position
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BOTTOM
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