Part Details for MP23DB01HPTR by STMicroelectronics
Results Overview of MP23DB01HPTR by STMicroelectronics
- Distributor Offerings: (25 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MP23DB01HPTR
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
82AH7595
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Newark | Mems Microphone, Rhlga-5, -40 To 85Deg C, Audio Control Type:Mems Microphone, Supply Voltage Range:1.6V To 3.6V, Control Interface:-, Audio Ic Case Style:Rhlga, No. Of Pins:5Pins, Operating Temperature Min:-40°C, Product Range:- Rohs Compliant: Yes |Stmicroelectronics MP23DB01HPTR RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Cut Tape | 773 |
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$1.7100 / $3.4200 | Buy Now |
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DISTI #
497-MP23DB01HPCT-ND
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DigiKey | MIC MEMS DIGITAL PDM OMNI -24DB Min Qty: 1 Lead time: 18 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
6953 In Stock |
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$1.3930 / $2.8300 | Buy Now |
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DISTI #
MP23DB01HPTR
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Avnet Americas | Audio Control, MEMS Microphone, 1.6 V to 3.6 V, RHLGA-5, -40 ?C to 85 ?C - Tape and Reel (Alt: MP23DB01HPTR) COO: China RoHS: Not Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 18 Weeks, 0 Days Container: Tape & Reel | 0 |
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$1.3267 / $1.4106 | Buy Now |
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DISTI #
511-MP23DB01HPTR
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Mouser Electronics | MEMS Microphones MEMS audio sensor multi performance mode digital microphone RoHS: Compliant | 4860 |
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$1.3900 / $2.8300 | Buy Now |
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DISTI #
V36:1790_19214878
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Arrow Electronics | Mic Omni-Directional -24dB 1.8V Rectangle Solder Pad COO: China RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 18 Weeks Date Code: 2351 | Americas - 90000 |
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$1.3000 | Buy Now |
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DISTI #
E02:0323_12823727
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Arrow Electronics | Mic Omni-Directional -24dB 1.8V Rectangle Solder Pad COO: China RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Lead time: 18 Weeks Date Code: 2443 | Europe - 5000 |
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$1.3304 | Buy Now |
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STMicroelectronics | Multi-mode High fidelity Digital bottom port MEMS microphone COO: Italy RoHS: Compliant Min Qty: 1 | 4860 |
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$1.5300 / $2.7700 | Buy Now |
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Future Electronics | MP23DB01HP Series 3.6 V 1.1 MHz Digital Microphone MEMS Audio Sensor RoHS: Compliant pbFree: Yes Min Qty: 1 Package Multiple: 1 Lead time: 18 Weeks Container: Cut Tape/Mini-Reel | 804Cut Tape/Mini-Reel |
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$1.4900 / $1.9400 | Buy Now |
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Future Electronics | MP23DB01HP Series 3.6 V 1.1 MHz Digital Microphone MEMS Audio Sensor RoHS: Compliant pbFree: Yes Min Qty: 5000 Package Multiple: 5000 Lead time: 18 Weeks Container: Reel | 0Reel |
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$0.9900 | Buy Now |
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DISTI #
78403856
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Verical | Mic Omni-Directional -24dB 1.8V Rectangle Solder Pad RoHS: Compliant Min Qty: 5000 Package Multiple: 5000 Date Code: 2351 | Americas - 90000 |
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$1.3000 | Buy Now |
US Tariff Estimator: MP23DB01HPTR by STMicroelectronics
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for MP23DB01HPTR
MP23DB01HPTR CAD Models
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3D Model
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MP23DB01HPTR Part Data Attributes
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MP23DB01HPTR
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
MP23DB01HPTR
STMicroelectronics
Consumer Circuit, CMOS
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Package Description | Lga, Lga5(Unspec) | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Date Of Intro | 2020-05-04 | |
| Consumer IC Type | Consumer Circuit | |
| JESD-30 Code | R-XBGA-N5 | |
| Length | 3.5 Mm | |
| Number of Functions | 1 | |
| Number of Terminals | 5 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | Unspecified | |
| Package Code | LGA | |
| Package Equivalence Code | LGA5(UNSPEC) | |
| Package Shape | Rectangular | |
| Package Style | Grid Array | |
| Peak Reflow Temperature (Cel) | Not Specified | |
| Seated Height-Max | 1.08 Mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 1.6 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Terminal Form | No Lead | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | Not Specified | |
| Width | 2.65 Mm |
MP23DB01HPTR Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
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To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended temperature range (-40°C to 150°C). Implement proper thermal management, such as heat sinks or thermal interfaces, to keep the device temperature below 125°C. Also, ensure that the PCB is designed to withstand high temperatures and that the device is properly soldered.
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The recommended soldering conditions for the MP23DB01HPTR are: peak temperature of 260°C, soldering time of 10-30 seconds, and a maximum of 2 reflows. Ensure that the PCB is designed to withstand the soldering process, and that the device is properly aligned and secured during soldering.
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To handle ESD protection for the MP23DB01HPTR, ensure that the device is handled and stored in an ESD-protected environment. Use ESD-protective packaging, and handle the device by the body or the pins, rather than the leads. Implement ESD protection circuits, such as TVS diodes or ESD arrays, in the system design.
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The recommended storage conditions for the MP23DB01HPTR are: temperature range of -40°C to 150°C, relative humidity of 60% or less, and protection from moisture and contamination. Store the device in its original packaging, and avoid exposing it to direct sunlight or extreme temperatures.