| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
MPC5554MVR132
|
Direct Components, Inc. | MCU 32-bit e200z6 RISC 2MB Flash 1.8V/2.5V/3.3V/5V Automotive 416-Pin BGA | 26 |
|
RFQ |
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
FREESCALE SEMICONDUCTOR INC
|
|
Part Package Code
|
BGA
|
|
Package Description
|
27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416
|
|
Pin Count
|
416
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.A.2
|
|
HTS Code
|
8542.31.00.01
|
|
Samacsys Manufacturer
|
NXP
|
|
Has ADC
|
YES
|
|
Additional Feature
|
IT ALSO REQUIRES 3.3V SUPPLY
|
|
Address Bus Width
|
24
|
|
Bit Size
|
32
|
|
Clock Frequency-Max
|
20 MHz
|
|
DAC Channels
|
NO
|
|
DMA Channels
|
NO
|
|
External Data Bus Width
|
32
|
|
JESD-30 Code
|
S-PBGA-B416
|
|
JESD-609 Code
|
e1
|
|
Length
|
27 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Terminals
|
416
|
|
On Chip Program ROM Width
|
8
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
PWM Channels
|
YES
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
HBGA
|
|
Package Equivalence Code
|
BGA416,26X26,40
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, HEAT SINK/SLUG
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
RAM (bytes)
|
65536
|
|
ROM (words)
|
2097152
|
|
ROM Programmability
|
FLASH
|
|
Seated Height-Max
|
2.55 mm
|
|
Speed
|
132 MHz
|
|
Supply Current-Max
|
600 mA
|
|
Supply Voltage-Max
|
1.65 V
|
|
Supply Voltage-Min
|
1.35 V
|
|
Supply Voltage-Nom
|
1.5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
AUTOMOTIVE
|
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
|
Width
|
27 mm
|
|
uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER
|
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MPC5554AZP132 | Freescale 32-bit MCU, Power Arch core, 2MB Flash, 132MHz, -55/+125degC, Automotive Grade, PBGA 416 | Freescale Semiconductor | MPC5554MVR132 vs MPC5554AZP132 |
| MPC5554AZP132R2 | 32-BIT, FLASH, 132MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | Freescale Semiconductor | MPC5554MVR132 vs MPC5554AZP132R2 |
| MPC5554AVR132R2 | 32-BIT, FLASH, 132MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416 | Freescale Semiconductor | MPC5554MVR132 vs MPC5554AVR132R2 |
| MPC5554MZP132 | 32-BIT, FLASH, 132MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | Freescale Semiconductor | MPC5554MVR132 vs MPC5554MZP132 |
| MPC5554MZP132R2 | Freescale 32-bit MCU, Power Arch core, 2MB Flash, 132MHz, -40/+125degC, Automotive Grade, PBGA 416 | Freescale Semiconductor | MPC5554MVR132 vs MPC5554MZP132R2 |
| MPC5554MZP132 | 32-BIT, FLASH, 132MHz, MICROCONTROLLER, PBGA416, 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 | Rochester Electronics LLC | MPC5554MVR132 vs MPC5554MZP132 |
| MPC5554MZP112 | Freescale 32-bit MCU, Power Arch core, 2MB Flash, 112MHz, -40/+125degC, Automotive Grade, PBGA 416 | Freescale Semiconductor | MPC5554MVR132 vs MPC5554MZP112 |
