Part Details for MR0D08BMA45 by Everspin Technologies
Overview of MR0D08BMA45 by Everspin Technologies
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for MR0D08BMA45
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
819-1031-ND
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DigiKey | IC RAM 1MBIT PARALLEL 48FBGA Min Qty: 696 Lead time: 20 Weeks Container: Tray | Temporarily Out of Stock |
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$14.5873 | Buy Now |
DISTI #
936-MR0D08BMA45
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Mouser Electronics | MRAM 1Mb 3.3V 128Kx8 45ns Parallel MRAM RoHS: Compliant | 0 |
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$13.9700 | Order Now |
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Future Electronics | MR0D08B Series 1 M (128 K x 8) 45 ns Surface Mount Dual Supply MRAM - BGA-48 RoHS: Compliant pbFree: Yes Min Qty: 696 Package Multiple: 348 Lead time: 20 Weeks Container: Tray | 0Tray |
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$13.7000 | Buy Now |
Part Details for MR0D08BMA45
MR0D08BMA45 CAD Models
MR0D08BMA45 Part Data Attributes
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MR0D08BMA45
Everspin Technologies
Buy Now
Datasheet
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Compare Parts:
MR0D08BMA45
Everspin Technologies
Memory Circuit, 128KX8, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | EVERSPIN TECHNOLOGIES INC | |
Part Package Code | BGA | |
Package Description | LFBGA, BGA48,6X8,30 | |
Pin Count | 48 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Samacsys Manufacturer | Everspin Technologies | |
Access Time-Max | 45 ns | |
JESD-30 Code | S-PBGA-B48 | |
Length | 8 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 128KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA48,6X8,30 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.35 mm | |
Standby Current-Max | 0.008 A | |
Supply Current-Max | 0.065 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 8 mm |