Part Details for MR256DL08BMA45 by Everspin Technologies
Overview of MR256DL08BMA45 by Everspin Technologies
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MR256DL08BMA45
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
819-1062-ND
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DigiKey | IC RAM 256KBIT PARALLEL 48FBGA Min Qty: 696 Lead time: 20 Weeks Container: Tray | Limited Supply - Call |
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$6.9219 | Buy Now |
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DISTI #
936-MR256DL08BMA45
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Mouser Electronics | MRAM 256Kb, 2.7V 32K x 8 45ns Parallel MRAM RoHS: Compliant | 0 |
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$6.5600 / $6.6900 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 696 Package Multiple: 348 Lead time: 20 Weeks Container: Tray | 0Tray |
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$5.9500 | Buy Now |
Part Details for MR256DL08BMA45
MR256DL08BMA45 CAD Models
MR256DL08BMA45 Part Data Attributes
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MR256DL08BMA45
Everspin Technologies
Buy Now
Datasheet
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MR256DL08BMA45
Everspin Technologies
Memory Circuit, 32KX8, CMOS, PBGA48, 8 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, FBGA-48
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | EVERSPIN TECHNOLOGIES INC | |
| Part Package Code | BGA | |
| Package Description | LFBGA, | |
| Pin Count | 48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| JESD-30 Code | S-PBGA-B48 | |
| Length | 8 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.35 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 8 mm |