There are no models available for this part yet.
Overview of MR2A16AMA35 by Everspin Technologies
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for MR2A16AMA35 by Everspin Technologies
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
819-1018-ND
|
DigiKey | IC RAM 4MBIT PARALLEL 48FBGA Min Qty: 1 Lead time: 20 Weeks Container: Tray | Temporarily Out of Stock |
|
$20.1380 / $21.0900 | Buy Now | |
DISTI #
936-MR2A16AMA35
|
Mouser Electronics | MRAM 4Mb 3.3V 35ns 256Kx16 Prallel MRAM RoHS: Compliant | 0 |
|
$20.1300 | Order Now | |
Future Electronics | MR2A16 Series 256 K x 16 Bit 3.3 V 35 ns Asynchronous MRAM Memory - BGA-48 RoHS: Compliant pbFree: Yes Min Qty: 696 Package Multiple: 696 Lead time: 20 Weeks Container: Tray | 0Tray |
|
$19.7400 | Buy Now | ||
DISTI #
MR2A16AMA35
|
EBV Elektronik | NVRAM MRAM Parallel 4M-Bit 3.3V 48-Pin FBGA Tray (Alt: MR2A16AMA35) RoHS: Compliant Min Qty: 348 Package Multiple: 348 Lead time: 49 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
CAD Models for MR2A16AMA35 by Everspin Technologies
Part Data Attributes for MR2A16AMA35 by Everspin Technologies
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
EVERSPIN TECHNOLOGIES INC
|
Part Package Code
|
BGA
|
Package Description
|
LFBGA, BGA48,6X8,30
|
Pin Count
|
48
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.71
|
Samacsys Manufacturer
|
Everspin Technologies
|
Access Time-Max
|
35 ns
|
JESD-30 Code
|
S-PBGA-B48
|
Length
|
8 mm
|
Memory Density
|
4194304 bit
|
Memory IC Type
|
MEMORY CIRCUIT
|
Memory Width
|
16
|
Number of Functions
|
1
|
Number of Terminals
|
48
|
Number of Words
|
262144 words
|
Number of Words Code
|
256000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
256KX16
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LFBGA
|
Package Equivalence Code
|
BGA48,6X8,30
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.35 mm
|
Standby Current-Max
|
0.028 A
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
3 V
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.75 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
8 mm
|
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