Part Details for MSP430F5309IZXH by Texas Instruments
Overview of MSP430F5309IZXH by Texas Instruments
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MSP430F5309IZXH
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
296-MSP430F5309IZXH-ND
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DigiKey | IC MCU 16BIT 24KB FLASH 80NFBGA Min Qty: 1 Lead time: 18 Weeks Container: Tray |
576 In Stock |
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$2.3225 / $3.5800 | Buy Now |
DISTI #
595-MSP430F5309IZXH
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Mouser Electronics | 16-bit Microcontrollers - MCU 25 MHz MCU with 24KB Flash, 6KB SRAM, 10-bit ADC, comparator, DMA, UART/SPI/I2C, HW multiplier 80-NFBGA -40 to 85 RoHS: Compliant | 0 |
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$2.3200 | Order Now |
Part Details for MSP430F5309IZXH
MSP430F5309IZXH CAD Models
MSP430F5309IZXH Part Data Attributes
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MSP430F5309IZXH
Texas Instruments
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Datasheet
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MSP430F5309IZXH
Texas Instruments
25 MHz MCU with 24KB Flash, 6KB SRAM, 10-bit ADC, comparator, DMA, UART/SPI/I2C, HW multiplier 80-NFBGA -40 to 85
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | BGA, BGA80,9X9,20 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.31.00.01 | |
Date Of Intro | 2020-04-21 | |
Has ADC | YES | |
Additional Feature | ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 8 MHZ | |
Address Bus Width | ||
Bit Size | 16 | |
Boundary Scan | YES | |
CPU Family | MSP430 | |
Clock Frequency-Max | 32 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | ||
Format | FIXED POINT | |
Integrated Cache | NO | |
JESD-30 Code | S-PBGA-B80 | |
JESD-609 Code | e1 | |
Length | 5 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 3 | |
Number of External Interrupts | ||
Number of I/O Lines | 47 | |
Number of Serial I/Os | 4 | |
Number of Terminals | 80 | |
Number of Timers | 18 | |
On Chip Data RAM Width | 16 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA80,9X9,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (bytes) | 6144 | |
RAM (words) | 3072 | |
ROM (words) | 24576 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1 mm | |
Speed | 25 MHz | |
Supply Current-Max | 6.5 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 5 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |