Part Details for MT57W2MH8CF-6 by Micron Technology Inc
Overview of MT57W2MH8CF-6 by Micron Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Price & Stock for MT57W2MH8CF-6
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-MT57W2MH8CF-6-ND
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DigiKey | IC SRAM 18MBIT PAR 165FBGA Min Qty: 10 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
5907 In Stock |
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$30.7400 | Buy Now |
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Rochester Electronics | DDR SRAM, 2MX8, 0.5ns PBGA165 RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 5907 |
|
$26.3800 / $31.0300 | Buy Now |
Part Details for MT57W2MH8CF-6
MT57W2MH8CF-6 CAD Models
MT57W2MH8CF-6 Part Data Attributes:
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MT57W2MH8CF-6
Micron Technology Inc
Buy Now
Datasheet
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Compare Parts:
MT57W2MH8CF-6
Micron Technology Inc
DDR SRAM, 2MX8, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | 13 X 15 MM, 1 MM PITCH, FBGA-165 | |
| Pin Count | 165 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 4 Weeks | |
| Access Time-Max | 0.5 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e0 | |
| Length | 15 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.15 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.28 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm |
Alternate Parts for MT57W2MH8CF-6
This table gives cross-reference parts and alternative options found for MT57W2MH8CF-6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MT57W2MH8CF-6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MT57W2MH8CF-6 | DDR SRAM, 2MX8, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | Cypress Semiconductor | MT57W2MH8CF-6 vs MT57W2MH8CF-6 |