Part Details for NM27C256Q200 by Rochester Electronics LLC
Overview of NM27C256Q200 by Rochester Electronics LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Healthcare
Telecommunications
Part Details for NM27C256Q200
NM27C256Q200 CAD Models
NM27C256Q200 Part Data Attributes:
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NM27C256Q200
Rochester Electronics LLC
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Datasheet
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NM27C256Q200
Rochester Electronics LLC
UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | DIP | |
| Package Description | WINDOWED, CERDIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.969 mm | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for NM27C256Q200
This table gives cross-reference parts and alternative options found for NM27C256Q200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NM27C256Q200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27256-2DC | UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | NM27C256Q200 vs AM27256-2DC |
| NMC27C256BQE200 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | NM27C256Q200 vs NMC27C256BQE200 |
| AM27C256-200DE | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | NM27C256Q200 vs AM27C256-200DE |
| NMC27C256Q20 | IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | Texas Instruments | NM27C256Q200 vs NMC27C256Q20 |
| AM27C256-200DIB | UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 | Spansion | NM27C256Q200 vs AM27C256-200DIB |
| AM27256-2DEB | UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | NM27C256Q200 vs AM27256-2DEB |
| AD27C256-200V10 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | Intel Corporation | NM27C256Q200 vs AD27C256-200V10 |
| AM27C256-205DI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | NM27C256Q200 vs AM27C256-205DI |
| NMC27C256BQE200 | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | NM27C256Q200 vs NMC27C256BQE200 |
| TMS27C256-20JE | 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 | Texas Instruments | NM27C256Q200 vs TMS27C256-20JE |