Part Details for NM27LC256Q200 by Texas Instruments
Overview of NM27LC256Q200 by Texas Instruments
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for NM27LC256Q200
NM27LC256Q200 CAD Models
NM27LC256Q200 Part Data Attributes
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NM27LC256Q200
Texas Instruments
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Datasheet
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NM27LC256Q200
Texas Instruments
32KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Part Package Code | DIP | |
| Package Description | WDIP, DIP28,.6 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 200 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 13 V | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.009 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for NM27LC256Q200
This table gives cross-reference parts and alternative options found for NM27LC256Q200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NM27LC256Q200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TC54256AP | IC 32K X 8 OTPROM, 200 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Programmable ROM | Toshiba America Electronic Components | NM27LC256Q200 vs TC54256AP |
| AS27C256A-20JM/MIL | Memory IC | Micross Components | NM27LC256Q200 vs AS27C256A-20JM/MIL |
| TMS27PC256-2NL | 262 144-Bitprogrammable Read-Only Memory 28-PDIP 0 to 70 | Texas Instruments | NM27LC256Q200 vs TMS27PC256-2NL |
| M38510/22402BYA | UVPROM, 32KX8, 200ns, MOS, 0.5 X 0.625 INCH, DIP-28 | Intel Corporation | NM27LC256Q200 vs M38510/22402BYA |
| TMS27PC256-2NE4 | 32KX8 OTPROM, 200ns, PDIP28 | Texas Instruments | NM27LC256Q200 vs TMS27PC256-2NE4 |
| AS27C256A-20JI | Memory IC | Micross Components | NM27LC256Q200 vs AS27C256A-20JI |
| 27C256MQ20 | UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | NM27LC256Q200 vs 27C256MQ20 |
| NM27LC256QE200 | 32KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 | Texas Instruments | NM27LC256Q200 vs NM27LC256QE200 |
| CY27C256-200WI | UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Cypress Semiconductor | NM27LC256Q200 vs CY27C256-200WI |
| QP27C256L-200/XA | UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Teledyne e2v | NM27LC256Q200 vs QP27C256L-200/XA |