Datasheets
NMC27C16BQ200 by:

IC 2K X 8 UVPROM, 200 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM

Part Details for NMC27C16BQ200 by Texas Instruments

Overview of NMC27C16BQ200 by Texas Instruments

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage Aerospace and Defense

Part Details for NMC27C16BQ200

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NMC27C16BQ200 Part Data Attributes

NMC27C16BQ200 Texas Instruments
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NMC27C16BQ200 Texas Instruments IC 2K X 8 UVPROM, 200 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM
Part Life Cycle Code Transferred
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description WDIP, DIP24,.6
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Memory Density 16384 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 2048 words
Number of Words Code 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 25 V
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for NMC27C16BQ200

This table gives cross-reference parts and alternative options found for NMC27C16BQ200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C16BQ200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NMC27C16BQE200 UVPROM, 2KX8, 200ns, CMOS, CDIP24, WINDOWED, CERAMIC, DIP-24 Fairchild Semiconductor Corporation NMC27C16BQ200 vs NMC27C16BQE200
NMC27C16BQE200 2KX8 UVPROM, 200ns, CDIP24, CERAMIC, DIP-24 Texas Instruments NMC27C16BQ200 vs NMC27C16BQE200
Part Number Description Manufacturer Compare
M38510/21004BJX OTP ROM, 2KX8, 55ns, Bipolar, 0.5 X 0.75 INCH, DIP-24 QP Semiconductor NMC27C16BQ200 vs M38510/21004BJX
5962-8765005LA UVPROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24 QP Semiconductor NMC27C16BQ200 vs 5962-8765005LA
5962-8981503LA UVPROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor NMC27C16BQ200 vs 5962-8981503LA
5962-8765001LX UVPROM, 2KX8, 50ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor NMC27C16BQ200 vs 5962-8765001LX
5962-8765003JA UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor NMC27C16BQ200 vs 5962-8765003JA
M38510/21004BLA OTP ROM, 2KX8, 55ns, Bipolar, 0.25 X 0.75 INCH, DIP-24 QP Semiconductor NMC27C16BQ200 vs M38510/21004BLA
5962-8765002LX UVPROM, 2KX8, 55ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor NMC27C16BQ200 vs 5962-8765002LX
NMC27C16BQE200 2KX8 UVPROM, 200ns, CDIP24, CERAMIC, DIP-24 Texas Instruments NMC27C16BQ200 vs NMC27C16BQE200
MB7138-EWZSK 2KX8 OTPROM, 55ns, CDIP24, 0.300 INCH, CERDIP-24 FUJITSU Limited NMC27C16BQ200 vs MB7138-EWZSK
5962-8765005LX UVPROM, 2KX8, 25ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor NMC27C16BQ200 vs 5962-8765005LX

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