Part Details for P2010NSE2HFC by Freescale Semiconductor
Overview of P2010NSE2HFC by Freescale Semiconductor
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Part Details for P2010NSE2HFC
P2010NSE2HFC CAD Models
P2010NSE2HFC Part Data Attributes
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P2010NSE2HFC
Freescale Semiconductor
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Datasheet
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P2010NSE2HFC
Freescale Semiconductor
QorIQ, 32-Bit Power Arch SoC, 800MHz, DDR2/3 w/ECC, GbE, PCIe, SRIO, USB, SEC, 0 to 125C, Rev 2.1
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, WB-TEBGA II-689 | |
Pin Count | 689 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Address Bus Width | 16 | |
Boundary Scan | YES | |
Clock Frequency-Max | 100 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B689 | |
JESD-609 Code | e2 | |
Length | 31 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 689 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 2.46 mm | |
Speed | 800 MHz | |
Supply Voltage-Max | 1.1 V | |
Supply Voltage-Min | 1 V | |
Supply Voltage-Nom | 1.05 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver (Sn/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 31 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |