There are no models available for this part yet.
Overview of P2010NSE2HFC by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for P2010NSE2HFC by NXP Semiconductors
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
85AK9505
|
Newark | Qoriq, 32-Bit Power Arch Soc, 800Mhz, Ddr2/3 W/Ecc, Gbe, Pcie, Srio, Usb, Sec, 0 To 125C, Rev 2.1/ Tray Rohs Compliant: Yes |Nxp P2010NSE2HFC RoHS: Compliant Min Qty: 27 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$82.5800 / $89.0300 | Buy Now | |
DISTI #
P2010NSE2HFC
|
Avnet Americas | MPU QorIQ RISC 32-Bit 800MHz 1.5V/1.8V/2.5V/3.3V 689-Pin TEPBGA Tray - Trays (Alt: P2010NSE2HFC) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 2 Partner Stock |
|
RFQ | ||
Rochester Electronics | P2010 - QorIQ Single-Core Communications Processor RoHS: Compliant Status: Obsolete Min Qty: 1 | 2 |
|
$79.9700 / $94.0800 | Buy Now |
CAD Models for P2010NSE2HFC by NXP Semiconductors
Part Data Attributes for P2010NSE2HFC by NXP Semiconductors
P2010NSE2HFC
NXP Semiconductors
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
Package Description
|
31 X 31 MM, 2.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, WB-TEBGA II-689
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
5A002.A.1
|
HTS Code
|
8542.31.00.01
|
Factory Lead Time
|
4 Weeks
|
Samacsys Manufacturer
|
NXP
|
Address Bus Width
|
16
|
Boundary Scan
|
YES
|
Clock Frequency-Max
|
100 MHz
|
External Data Bus Width
|
64
|
Format
|
FLOATING POINT
|
Integrated Cache
|
YES
|
JESD-30 Code
|
S-PBGA-B689
|
JESD-609 Code
|
e2
|
Length
|
31 mm
|
Low Power Mode
|
YES
|
Moisture Sensitivity Level
|
3
|
Number of Terminals
|
689
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Peak Reflow Temperature (Cel)
|
260
|
Seated Height-Max
|
2.46 mm
|
Speed
|
800 MHz
|
Supply Voltage-Max
|
1.1 V
|
Supply Voltage-Min
|
1 V
|
Supply Voltage-Nom
|
1.05 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Terminal Finish
|
Tin/Silver (Sn/Ag)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
40
|
Width
|
31 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
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