Part Details for P4C168-25CM by Pyramid Semiconductor Corporation
Overview of P4C168-25CM by Pyramid Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Renewable Energy
Automotive
Robotics and Drones
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| LTC1992-5CMS8#PBF | Analog Devices | L Pwr, Fully Diff In/Out Amp/D | |
| LTC1992-5CMS8#TRPBF | Analog Devices | L Pwr, Fully Diff In/Out Amp/D | |
| BCR25CM-12LB#BB0 | Renesas Electronics Corporation | 600V - 25A - Triac Medium Power Use, TO-220AB, /Tube |
Part Details for P4C168-25CM
P4C168-25CM CAD Models
P4C168-25CM Part Data Attributes
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P4C168-25CM
Pyramid Semiconductor Corporation
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Datasheet
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P4C168-25CM
Pyramid Semiconductor Corporation
Standard SRAM, 4KX4, 25ns, CMOS, CDIP20, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | PYRAMID SEMICONDUCTOR CORP | |
| Part Package Code | DIP | |
| Package Description | 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 | |
| Pin Count | 20 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 25 ns | |
| JESD-30 Code | R-CDIP-T20 | |
| JESD-609 Code | e0 | |
| Length | 25.908 mm | |
| Memory Density | 16384 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 4KX4 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.12 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for P4C168-25CM
This table gives cross-reference parts and alternative options found for P4C168-25CM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of P4C168-25CM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| P4C168-25CMB | Standard SRAM, 4KX4, 25ns, CMOS, CDIP20, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 | Pyramid Semiconductor Corporation | P4C168-25CM vs P4C168-25CMB |
| P4C168L-25CMB | Standard SRAM, 4KX4, 25ns, CMOS, CDIP20, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 | Pyramid Semiconductor Corporation | P4C168-25CM vs P4C168L-25CMB |