Part Details for P89LPC933FDH by NXP Semiconductors
Overview of P89LPC933FDH by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for P89LPC933FDH
Part # | Distributor | Description | Stock | Price | Buy | |
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Sense Electronic Company Limited | TSSOP28 | 2634 |
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RFQ |
Part Details for P89LPC933FDH
P89LPC933FDH CAD Models
P89LPC933FDH Part Data Attributes
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P89LPC933FDH
NXP Semiconductors
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Datasheet
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P89LPC933FDH
NXP Semiconductors
8-BIT, FLASH, 18MHz, MICROCONTROLLER, PDSO28, 4.40 MM, PLASTIC, MO-153, SOT-361-1, TSSOP-28
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | TSSOP | |
Package Description | 4.40 MM, PLASTIC, MO-153, SOT-361-1, TSSOP-28 | |
Pin Count | 28 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Additional Feature | ALSO OPERATES BETWEEN 2.4 V AT 12 MHZ | |
Address Bus Width | ||
Bit Size | 8 | |
CPU Family | 8051 | |
Clock Frequency-Max | 18 MHz | |
DAC Channels | YES | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | R-PDSO-G28 | |
JESD-609 Code | e4 | |
Length | 9.7 mm | |
Moisture Sensitivity Level | 2 | |
Number of I/O Lines | 26 | |
Number of Terminals | 28 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP28,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 256 | |
ROM (words) | 4096 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.1 mm | |
Speed | 18 MHz | |
Supply Current-Max | 18 mA | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 4.4 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |