Part Details for PCA9601DP,118 by NXP Semiconductors
Results Overview of PCA9601DP,118 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
PCA9601DP,118 Information
PCA9601DP,118 by NXP Semiconductors is an Other Interface IC.
Other Interface ICs are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for PCA9601DP,118
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
41AH8235
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Newark | Bidirectional Bus Buffer, Dual, Tssop-8, Logic Device Type:Bidirectional Bus Buffer, Logic Family/Base Number:Pca9601, Ic Case/Package:Tssop, No. Of Pins:8Pins, Supply Voltage Min:2.5V, Supply Voltage Max:15V, Logic Ic Family:- Rohs Compliant: Yes |Nxp PCA9601DP,118 RoHS: Compliant Min Qty: 2500 Package Multiple: 1 Date Code: 0 Container: Cut Tape | 0 |
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Buy Now | |
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Vyrian | Interface ICs | 5468 |
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RFQ |
US Tariff Estimator: PCA9601DP,118 by NXP Semiconductors
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for PCA9601DP,118
PCA9601DP,118 CAD Models
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PCA9601DP,118 Part Data Attributes
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PCA9601DP,118
NXP Semiconductors
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Datasheet
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PCA9601DP,118
NXP Semiconductors
PCA9601 - Dual bidirectional bus buffer TSSOP 8-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Part Package Code | TSSOP | |
| Package Description | Tssop, Tssop8,.19 | |
| Pin Count | 8 | |
| Manufacturer Package Code | SOT505-1 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 52 Weeks | |
| Interface IC Type | Bus Buffers | |
| JESD-30 Code | S-PDSO-G8 | |
| Length | 3 Mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP8,.19 | |
| Package Shape | Rectangular | |
| Package Style | Small Outline, Thin Profile, Shrink Pitch | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 1.1 Mm | |
| Supply Voltage-Max | 15 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | Yes | |
| Terminal Form | Gull Wing | |
| Terminal Pitch | 0.65 Mm | |
| Terminal Position | Dual | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 3 Mm |
PCA9601DP,118 Frequently Asked Questions (FAQ)
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A good PCB layout for PCA9601DP,118 involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
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To ensure EMC with PCA9601DP,118, use a shielded enclosure, keep cables and wires as short as possible, and use ferrite beads or common-mode chokes on cables. Also, ensure that the PCB layout is optimized for EMC, and use a common-mode filter if necessary.
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The maximum operating temperature range for PCA9601DP,118 is -40°C to +125°C. However, the device can be operated at a reduced temperature range of -20°C to +85°C for most applications.
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Yes, PCA9601DP,118 is designed to withstand high-vibration environments. However, it's recommended to follow proper mounting and soldering procedures to ensure the device is securely attached to the PCB.
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To troubleshoot issues with PCA9601DP,118, start by checking the power supply voltage, then verify the input and output signals using an oscilloscope. Check for any signs of overheating, and ensure that the device is properly soldered and mounted on the PCB.