Part Details for R4F2113NBG by Renesas Electronics Corporation
Overview of R4F2113NBG by Renesas Electronics Corporation
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Part Details for R4F2113NBG
R4F2113NBG CAD Models
R4F2113NBG Part Data Attributes
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R4F2113NBG
Renesas Electronics Corporation
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R4F2113NBG
Renesas Electronics Corporation
Microcontrollers for Office Equipment Applications (Non Promotion), , /
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, LFBGA-176 | |
| Pin Count | 176 | |
| Manufacturer Package Code | PLBG0176GA-A | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 16 | |
| Boundary Scan | NO | |
| CPU Family | H8S/2000 | |
| Clock Frequency-Max | 20 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| Format | FIXED POINT | |
| Integrated Cache | NO | |
| JESD-30 Code | S-PBGA-B176 | |
| Length | 13 mm | |
| Low Power Mode | YES | |
| Number of External Interrupts | 49 | |
| Number of I/O Lines | 130 | |
| Number of Serial I/Os | 3 | |
| Number of Terminals | 176 | |
| Number of Timers | 5 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 75 °C | |
| Operating Temperature-Min | -20 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA176,15X15,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| RAM (bytes) | 12288 | |
| ROM (words) | 131072 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.4 mm | |
| Speed | 20 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |