Part Details for R5F21181SP#W4 by Renesas Electronics Corporation
Overview of R5F21181SP#W4 by Renesas Electronics Corporation
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
R5F21181SP#W4 | Renesas Electronics Corporation | 16-bit Microcontrollers with R8C CPU Core (Non Promotion) | |
R5F21181SP#U0 | Renesas Electronics Corporation | 16-bit Microcontrollers with R8C CPU Core (Non Promotion) |
Part Details for R5F21181SP#W4
R5F21181SP#W4 CAD Models
R5F21181SP#W4 Part Data Attributes
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R5F21181SP#W4
Renesas Electronics Corporation
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Datasheet
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R5F21181SP#W4
Renesas Electronics Corporation
16-bit Microcontrollers with R8C CPU Core (Non Promotion), LSSOP, /Embossed Tape
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | LSSOP | |
Package Description | LSSOP, | |
Pin Count | 20 | |
Manufacturer Package Code | PLSP0020JB | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Renesas Electronics | |
Has ADC | NO | |
Address Bus Width | ||
Bit Size | 16 | |
Boundary Scan | NO | |
Clock Frequency-Max | 20 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | R-PDSO-G20 | |
Length | 6.5 mm | |
Number of I/O Lines | 16 | |
Number of Terminals | 20 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -20 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LSSOP | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
ROM (words) | 4096 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.45 mm | |
Speed | 20 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 4.4 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |