Part Details for R5F212BASNFP#X6 by Renesas Electronics Corporation
Overview of R5F212BASNFP#X6 by Renesas Electronics Corporation
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for R5F212BASNFP#X6
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
559-R5F212BASNFP#X6TR-ND
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DigiKey | IC MCU 16BIT 96KB FLASH 64LFQFP Lead time: 18 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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Buy Now | |
|
DISTI #
R5F212BASNFP#X6
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Avnet Silica | MCU 16-Bit R8C/2B R8C CISC 96KB Flash 3.3V/5V 64-Pin LFQFP T/R (Alt: R5F212BASNFP#X6) RoHS: Compliant Min Qty: 1500 Package Multiple: 1500 Lead time: 4 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
|
|
Win Source Electronics | 9360 |
|
$6.5950 / $9.8920 | Buy Now |
Part Details for R5F212BASNFP#X6
R5F212BASNFP#X6 CAD Models
R5F212BASNFP#X6 Part Data Attributes
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R5F212BASNFP#X6
Renesas Electronics Corporation
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Datasheet
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R5F212BASNFP#X6
Renesas Electronics Corporation
16-bit Microcontrollers with R8C CPU Core (Non Promotion), LQFP, /Tape
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | LQFP | |
| Package Description | LFQFP, QFP64,.47SQ,20 | |
| Pin Count | 64 | |
| Manufacturer Package Code | PLQP0064KB | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Has ADC | YES | |
| Additional Feature | ALSO OPERATES AT 2.2V SUPPLY AT 5 MHZ | |
| Address Bus Width | ||
| Bit Size | 16 | |
| CPU Family | R8C | |
| Clock Frequency-Max | 20 MHz | |
| DAC Channels | YES | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G64 | |
| JESD-609 Code | e3 | |
| Length | 10 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 57 | |
| Number of Terminals | 64 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -20 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP64,.47SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 7168 | |
| ROM (words) | 98304 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.7 mm | |
| Speed | 20 MHz | |
| Supply Current-Max | 20 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |