Part Details for R5F61642GN50BGV by Renesas Electronics Corporation
Overview of R5F61642GN50BGV by Renesas Electronics Corporation
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for R5F61642GN50BGV
R5F61642GN50BGV CAD Models
R5F61642GN50BGV Part Data Attributes
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R5F61642GN50BGV
Renesas Electronics Corporation
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Datasheet
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R5F61642GN50BGV
Renesas Electronics Corporation
Microcontrollers with 32-bit CISC CPU for System Control Applications (Non Promotion), LFBGA, /Tray
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | LFBGA | |
Package Description | FBGA, | |
Pin Count | 176 | |
Manufacturer Package Code | PLBG0176GA | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Renesas Electronics | |
Has ADC | YES | |
Address Bus Width | 24 | |
Bit Size | 32 | |
Clock Frequency-Max | 50 MHz | |
DMA Channels | YES | |
External Data Bus Width | 16 | |
Length | 20 mm | |
Number of I/O Lines | 126 | |
Number of Terminals | 176 | |
PWM Channels | YES | |
Package Code | FBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
ROM (words) | 262144 | |
Speed | 50 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 20 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |