Part Details for RD28F1602C390 by Intel Corporation
Overview of RD28F1602C390 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for RD28F1602C390
RD28F1602C390 CAD Models
RD28F1602C390 Part Data Attributes
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RD28F1602C390
Intel Corporation
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Datasheet
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RD28F1602C390
Intel Corporation
Memory Circuit, 1MX16, CMOS, PBGA72, 8 X 10 MM, STACK, CSP-72
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Part Package Code | BGA | |
Package Description | LFBGA, | |
Pin Count | 72 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | SRAM IS ORGANISED AS 128K X 16 | |
JESD-30 Code | R-PBGA-B72 | |
Length | 12 mm | |
Memory Density | 16777216 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 72 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 1MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |
Alternate Parts for RD28F1602C390
This table gives cross-reference parts and alternative options found for RD28F1602C390. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of RD28F1602C390, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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LRS1392 | Memory Circuit, 4MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72 | Sharp Corp | RD28F1602C390 vs LRS1392 |
LRS1807A | Memory Circuit, 2MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72 | Sharp Corp | RD28F1602C390 vs LRS1807A |
LRS1380 | Memory Circuit, 2MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72 | Sharp Corp | RD28F1602C390 vs LRS1380 |
LRS1844 | Memory Circuit, 2MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72 | Sharp Corp | RD28F1602C390 vs LRS1844 |
LRS1393A | Memory Circuit, 4MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72 | Sharp Corp | RD28F1602C390 vs LRS1393A |
LRS1395 | Memory Circuit, 8MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72 | Sharp Corp | RD28F1602C390 vs LRS1395 |
LRS1811 | Memory Circuit, 4MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72 | Sharp Corp | RD28F1602C390 vs LRS1811 |
LRS1383H | Memory Circuit, 2MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72 | Sharp Corp | RD28F1602C390 vs LRS1383H |
LRS1382 | Memory Circuit, 2MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72 | Sharp Corp | RD28F1602C390 vs LRS1382 |
LRS1331 | Memory Circuit, 1MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, FBGA-72 | Sharp Corp | RD28F1602C390 vs LRS1331 |