Part Details for RPC56EL70L5CBFSY by STMicroelectronics
Results Overview of RPC56EL70L5CBFSY by STMicroelectronics
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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RPC56EL70L5CBFSY Information
RPC56EL70L5CBFSY by STMicroelectronics is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
US Tariff Estimator: RPC56EL70L5CBFSY by STMicroelectronics
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
RPC56EL70L5CBFSY Part Data Attributes
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RPC56EL70L5CBFSY
STMicroelectronics
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Datasheet
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RPC56EL70L5CBFSY
STMicroelectronics
RPC56EL70L5CBFSY
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active Unconfirmed | |
| Package Description | Lqfp-144 | |
| HTS Code | 8542.31.00.30 | |
| JESD-30 Code | S-PQFP-G144 | |
| Length | 20 Mm | |
| Number of Terminals | 144 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.86SQ,20 | |
| Package Shape | Square | |
| Package Style | Flatpack, Low Profile, Fine Pitch | |
| Seated Height-Max | 1.6 Mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Terminal Form | Gull Wing | |
| Terminal Pitch | 0.5 Mm | |
| Terminal Position | Quad | |
| Width | 20 Mm | |
| uPs/uCs/Peripheral ICs Type | Soc |
RPC56EL70L5CBFSY Frequently Asked Questions (FAQ)
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STMicroelectronics provides a recommended PCB layout in their application note AN5163, which includes guidelines for thermal pad connection, thermal vias, and copper pouring to ensure optimal thermal performance.
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The thermal shutdown feature is enabled by default. To handle it, monitor the TSD pin, which goes low when the device reaches the thermal shutdown temperature (typically 170°C). When TSD is low, the device is in shutdown mode, and the output voltage is disabled. To recover, reduce the power consumption or improve the thermal dissipation to bring the device temperature below the thermal shutdown threshold.
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The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device. Ensure that the voltage on the EN pin does not exceed 6V, even during startup or fault conditions.
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The output voltage ripple can be calculated using the formula: ΔVout = (Iout * ESL) / (Cout * fsw), where Iout is the output current, ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency. This calculation assumes a steady-state operation and does not account for transient events.
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STMicroelectronics recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value between 4.7μF and 10μF for the input capacitor. This ensures stable operation and minimizes voltage ripple on the input side.