Part Details for SMJ320C6201BGLPS20 by Texas Instruments
Overview of SMJ320C6201BGLPS20 by Texas Instruments
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Part Details for SMJ320C6201BGLPS20
SMJ320C6201BGLPS20 CAD Models
SMJ320C6201BGLPS20 Part Data Attributes
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SMJ320C6201BGLPS20
Texas Instruments
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SMJ320C6201BGLPS20
Texas Instruments
32-BIT, 200MHz, OTHER DSP, CBGA429, CERAMIC, MO-156, BGA-429
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA429,21X21,50 | |
Pin Count | 429 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | -40 TO 90 OPERATING CASE TEMPERATURE | |
Address Bus Width | 22 | |
Barrel Shifter | NO | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 200 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-CBGA-B429 | |
Length | 27 mm | |
Low Power Mode | YES | |
Number of Terminals | 429 | |
Operating Temperature-Max | 90 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Equivalence Code | BGA429,21X21,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
RAM (words) | 65536 | |
Screening Level | MIL-PRF-38535 | |
Seated Height-Max | 3.3 mm | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 27 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |