Part Details for STM32F103RDY6 by STMicroelectronics
Overview of STM32F103RDY6 by STMicroelectronics
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Part Details for STM32F103RDY6
STM32F103RDY6 CAD Models
STM32F103RDY6 Part Data Attributes
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STM32F103RDY6
STMicroelectronics
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Datasheet
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STM32F103RDY6
STMicroelectronics
IC,MICROCONTROLLER,32-BIT,CORTEX-M3 CPU,CMOS,BGA,64PIN,PLASTIC
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | CSP | |
Package Description | WLCSP-64 | |
Pin Count | 64 | |
Reach Compliance Code | compliant | |
Bit Size | 32 | |
CPU Family | CORTEX-M3 | |
JESD-30 Code | S-PBGA-B64 | |
Number of Terminals | 64 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA64,8X8,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Power Supplies | 2.5/3.3 V | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 393216 | |
ROM Programmability | FLASH | |
Speed | 72 MHz | |
Supply Current-Max | 70 mA | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM |