Part Details for TC55V16176FF-167 by Toshiba America Electronic Components
Overview of TC55V16176FF-167 by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Part Details for TC55V16176FF-167
TC55V16176FF-167 CAD Models
TC55V16176FF-167 Part Data Attributes
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TC55V16176FF-167
Toshiba America Electronic Components
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Datasheet
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TC55V16176FF-167
Toshiba America Electronic Components
IC 1M X 18 CACHE SRAM, 3.6 ns, PQFP100, 14 X 20 MM, 1.60 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100, Static RAM
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | QFP | |
| Package Description | LQFP, QFP100,.63X.87 | |
| Pin Count | 100 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 3.6 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 167 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PQFP-G100 | |
| JESD-609 Code | e0 | |
| Length | 20 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LQFP | |
| Package Equivalence Code | QFP100,.63X.87 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Standby Current-Max | 0.01 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.42 mA | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm |
Alternate Parts for TC55V16176FF-167
This table gives cross-reference parts and alternative options found for TC55V16176FF-167. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC55V16176FF-167, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IS61NLF12832-10B | ZBT SRAM, 128KX32, 10ns, CMOS, PBGA119, PLASTIC, BGA-119 | Integrated Silicon Solution Inc | TC55V16176FF-167 vs IS61NLF12832-10B |
| MCM69F817ZP7 | 256KX18 CACHE SRAM, 7ns, PBGA119, 7 X 17 MM, PLASTIC, BGA-119 | Motorola Mobility LLC | TC55V16176FF-167 vs MCM69F817ZP7 |
| CY7C1317V18-250BZC | DDR SRAM, 2MX8, 0.35ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 | Cypress Semiconductor | TC55V16176FF-167 vs CY7C1317V18-250BZC |
| CY7C1394V18-200BZC | DDR SRAM, 512KX36, 0.38ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 | Cypress Semiconductor | TC55V16176FF-167 vs CY7C1394V18-200BZC |
| MT58LC128K36C5LG-8TR | Standard SRAM, 128KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Micron Technology Inc | TC55V16176FF-167 vs MT58LC128K36C5LG-8TR |
| IS61QDP2B21M36A-300B4I | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | TC55V16176FF-167 vs IS61QDP2B21M36A-300B4I |
| MCM69L737AZP7.5R | Cache SRAM, 128KX36, 7.5ns, BICMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119 | Motorola Semiconductor Products | TC55V16176FF-167 vs MCM69L737AZP7.5R |
| KM736V795T-72T | Cache SRAM, 128KX36, 4ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 | Samsung Semiconductor | TC55V16176FF-167 vs KM736V795T-72T |
| IS61VF12836A-7.5B3I | Cache SRAM, 128KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, BGA-165 | Integrated Silicon Solution Inc | TC55V16176FF-167 vs IS61VF12836A-7.5B3I |
| CY7C1381AV25-117AC | Standard SRAM, 512KX36, 7.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cypress Semiconductor | TC55V16176FF-167 vs CY7C1381AV25-117AC |