Part Details for TC57H1025AD-70 by Toshiba America Electronic Components
Overview of TC57H1025AD-70 by Toshiba America Electronic Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for TC57H1025AD-70
TC57H1025AD-70 CAD Models
TC57H1025AD-70 Part Data Attributes
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TC57H1025AD-70
Toshiba America Electronic Components
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Datasheet
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TC57H1025AD-70
Toshiba America Electronic Components
IC 64K X 16 UVPROM, 70 ns, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40, Programmable ROM
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | DIP | |
| Package Description | WDIP, | |
| Pin Count | 40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 70 ns | |
| JESD-30 Code | R-GDIP-T40 | |
| JESD-609 Code | e0 | |
| Length | 52.07 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 40 | |
| Number of Words | 65536 words | |
| Number of Words Code | 64000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 64KX16 | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 6.05 mm | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for TC57H1025AD-70
This table gives cross-reference parts and alternative options found for TC57H1025AD-70. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC57H1025AD-70, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M27V102-200F6 | 64KX16 UVPROM, 200ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40 | STMicroelectronics | TC57H1025AD-70 vs M27V102-200F6 |
| TMS27C210A-200JE4 | 64KX16 UVPROM, 200ns, CDIP40, 0.600 INCH, WINDOWED, CERAMIC, DIP-40 | Texas Instruments | TC57H1025AD-70 vs TMS27C210A-200JE4 |
| CY7B210-30WI | UVPROM, 64KX16, 30ns, BICMOS, CDIP40, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-40 | Cypress Semiconductor | TC57H1025AD-70 vs CY7B210-30WI |
| AM27C1024-155DI | UVPROM, 64KX16, 150ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | AMD | TC57H1025AD-70 vs AM27C1024-155DI |
| AT27C1024-70DC | UVPROM, 64KX16, 70ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 | Atmel Corporation | TC57H1025AD-70 vs AT27C1024-70DC |
| AT27HC1024-70DM | UVPROM, 64KX16, 70ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 | Atmel Corporation | TC57H1025AD-70 vs AT27HC1024-70DM |
| AT27C1024-17KM/883 | UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, JLCC-44 | Atmel Corporation | TC57H1025AD-70 vs AT27C1024-17KM/883 |
| M27C1024-10F6X | 64KX16 UVPROM, 100ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 | STMicroelectronics | TC57H1025AD-70 vs M27C1024-10F6X |
| M27C1024-70F6 | 64KX16 UVPROM, 70ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 | STMicroelectronics | TC57H1025AD-70 vs M27C1024-70F6 |
| M27C1024-90XF6X | 64KX16 UVPROM, 80ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 | STMicroelectronics | TC57H1025AD-70 vs M27C1024-90XF6X |