Part Details for TCI6630K2LSCMSA by Texas Instruments
Results Overview of TCI6630K2LSCMSA by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TCI6630K2LSCMSA Information
TCI6630K2LSCMSA by Texas Instruments is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for TCI6630K2LSCMSA
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Microprocessor Circuit, CMOS, PBGA900 | 7469 |
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RFQ |
US Tariff Estimator: TCI6630K2LSCMSA by Texas Instruments
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
TCI6630K2LSCMSA Part Data Attributes
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TCI6630K2LSCMSA
Texas Instruments
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Datasheet
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TCI6630K2LSCMSA
Texas Instruments
SoC, CMOS, PBGA900
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Package Description | 25 X 25mm, Lead Free, Plastic, Fcbga-900 | |
| HTS Code | 8542.31.00.30 | |
| JESD-30 Code | S-PBGA-B900 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 900 | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | BGA | |
| Package Shape | Square | |
| Package Style | Grid Array | |
| Peak Reflow Temperature (Cel) | 245 | |
| Supply Voltage-Max | 0.997 V | |
| Supply Voltage-Min | 0.902 V | |
| Supply Voltage-Nom | 0.95 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | Ball | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| uPs/uCs/Peripheral ICs Type | Soc |