Part Details for TD27C256-120V10 by Intel Corporation
Overview of TD27C256-120V10 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for TD27C256-120V10
TD27C256-120V10 CAD Models
TD27C256-120V10 Part Data Attributes
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TD27C256-120V10
Intel Corporation
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Datasheet
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TD27C256-120V10
Intel Corporation
UVPROM, 32KX8, 120ns, CMOS, CDIP28, WINDOWED, CERDIP-28
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Part Package Code | DIP | |
Package Description | WINDOWED, CERDIP-28 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 120 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T28 | |
JESD-609 Code | e0 | |
Length | 37.15 mm | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 12.75 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.72 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for TD27C256-120V10
This table gives cross-reference parts and alternative options found for TD27C256-120V10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TD27C256-120V10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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CY27C256A-120WC | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | Cypress Semiconductor | TD27C256-120V10 vs CY27C256A-120WC |
AT27HC256R-12DC | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Atmel Corporation | TD27C256-120V10 vs AT27HC256R-12DC |
TC57256AD-12 | IC 32K X 8 UVPROM, 120 ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28, Programmable ROM | Toshiba America Electronic Components | TD27C256-120V10 vs TC57256AD-12 |
M27C256B-12F6 | 32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | TD27C256-120V10 vs M27C256B-12F6 |
FT27C256R-12DC | UVPROM, 32KX8, 12ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Force Technologies Ltd | TD27C256-120V10 vs FT27C256R-12DC |
M27C256B-12F1 | 32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | TD27C256-120V10 vs M27C256B-12F1 |
M27C256B-12F6E | 32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | TD27C256-120V10 vs M27C256B-12F6E |
AS27C256-12JM | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Micross Components | TD27C256-120V10 vs AS27C256-12JM |
AM27C256-120/BXA | UVPROM, 32KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | TD27C256-120V10 vs AM27C256-120/BXA |
M5M27C256AK-12 | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28 | Mitsubishi Electric | TD27C256-120V10 vs M5M27C256AK-12 |