| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| TDA749313TR | STMicroelectronics | Check for Price | CLASS D AUDIO AMPLIFIER, 3W, 2 Channel(s), 1 Func, PDSO24 | TDA7493 vs TDA749313TR |
Part Details for TDA7493 by STMicroelectronics
Results Overview of TDA7493 by STMicroelectronics
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (1 option)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for TDA7493
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
TDA7493-ND
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DigiKey | IC AUDIO AMP D 24-HTSSOP Min Qty: 1240 Container: Tube |
0 Tube |
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$1.1869 | Buy Now |
|
|
Vyrian | Audio Amplifier, 3W, 2 Channel(s), 1 Func, PDSO24 | 8063 |
|
RFQ |
US Tariff Estimator: TDA7493 by STMicroelectronics
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
TDA7493 CAD Models
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TDA7493 Part Data Attributes
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TDA7493
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
TDA7493
STMicroelectronics
CLASS D AUDIO AMPLIFIER, 3W, 2 Channel(s), 1 Func, PDSO24
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Part Package Code | TSSOP | |
| Package Description | Rohs Compliant, Mo-153adt, Ssop-24 | |
| Pin Count | 24 | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Bandwidth-Nom | 22 Khz | |
| Consumer IC Type | Class D Audio Amplifier | |
| Gain | 18 Db | |
| Harmonic Distortion | 10% | |
| JESD-30 Code | R-PDSO-G24 | |
| Length | 7.8 Mm | |
| Number of Channels | 2 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Output Power-Nom | 3 W | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | HTSSOP | |
| Package Equivalence Code | TSSOP24,.25 | |
| Package Shape | Rectangular | |
| Package Style | Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 Mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Surface Mount | Yes | |
| Temperature Grade | Commercial | |
| Terminal Form | Gull Wing | |
| Terminal Pitch | 0.65 Mm | |
| Terminal Position | Dual | |
| Width | 4.4 Mm |
Alternate Parts for TDA7493
This table gives cross-reference parts and alternative options found for TDA7493. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TDA7493, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
TDA7493 Frequently Asked Questions (FAQ)
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STMicroelectronics recommends using a 10uF ceramic capacitor and a 100nF ceramic capacitor in parallel, placed as close as possible to the power supply pins (VP and VN) to ensure stable operation.
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The gain of the TDA7493 can be configured by connecting a resistor (Rg) between the GAIN pin and the negative power supply (VN). The gain is calculated as 20 dB + (Rg/1.2 kΩ).
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The maximum power dissipation of the TDA7493 is 20W, assuming a junction temperature of 150°C and a thermal resistance of 2.5°C/W. However, this value can be derated based on the ambient temperature and the thermal design of the system.
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The TDA7493 has a built-in thermal shutdown feature that turns off the amplifier if the junction temperature exceeds 150°C. Additionally, a heatsink can be used to dissipate heat, and the system design should ensure good airflow and thermal management.
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STMicroelectronics recommends a 4-layer PCB with a solid ground plane, and the power supply lines should be routed away from the signal lines to minimize noise and electromagnetic interference (EMI).