Datasheets
TEA1118M/C2 by:

IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PDSO16, PLASTIC, SOT-369, SSOP-16, Cordless Telephone IC

Part Details for TEA1118M/C2 by NXP Semiconductors

Overview of TEA1118M/C2 by NXP Semiconductors

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Part Details for TEA1118M/C2

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TEA1118M/C2 Part Data Attributes

TEA1118M/C2 NXP Semiconductors
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TEA1118M/C2 NXP Semiconductors IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PDSO16, PLASTIC, SOT-369, SSOP-16, Cordless Telephone IC
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description PLASTIC, SOT-369, SSOP-16
Pin Count 16
Reach Compliance Code unknown
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-G16
Length 5.2 mm
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 75 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code LSSOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Supply Current-Max 1.4 mA
Supply Voltage-Nom 2.9 V
Surface Mount YES
Technology BIPOLAR
Telecom IC Type CORDLESS TELEPHONE BASEBAND CIRCUIT
Temperature Grade COMMERCIAL EXTENDED
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Width 4.4 mm

Alternate Parts for TEA1118M/C2

This table gives cross-reference parts and alternative options found for TEA1118M/C2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TEA1118M/C2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
935237440112 IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PDSO16, PLASTIC, SOT-369, SSOP-16, Cordless Telephone IC NXP Semiconductors TEA1118M/C2 vs 935237440112
935237440118 IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PDSO16, PLASTIC, SOT-369, SSOP-16, Cordless Telephone IC NXP Semiconductors TEA1118M/C2 vs 935237440118
Part Number Description Manufacturer Compare
TA31101AF(ER) IC TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO16, 0.225 INCH, PLASTIC, SSOP-16, Cordless Telephone IC Toshiba America Electronic Components TEA1118M/C2 vs TA31101AF(ER)
BU8244F Support Circuit, PDSO16, SOP-16 ROHM Semiconductor TEA1118M/C2 vs BU8244F
935237440118 IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PDSO16, PLASTIC, SOT-369, SSOP-16, Cordless Telephone IC NXP Semiconductors TEA1118M/C2 vs 935237440118
RF2403 Baseband Circuit, PDSO16, PLASTIC, SOP-16 RF Micro Devices Inc TEA1118M/C2 vs RF2403
BU8244F-T1 TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO16, SOP-16 ROHM Semiconductor TEA1118M/C2 vs BU8244F-T1
BU8244F-DXT1 Support Circuit, PDSO16, SOP-16 ROHM Semiconductor TEA1118M/C2 vs BU8244F-DXT1
953237440118 IC TELECOM, CORDLESS, BASEBAND CIRCUIT, PDSO16, PLASTIC, SOT-369, SSOP-16, Cordless Telephone IC NXP Semiconductors TEA1118M/C2 vs 953237440118
MX118DW Cordless Telephone Scrambler/Descrambler, CMOS, PDSO16, SOIC-16 CML Microcircuits Plc TEA1118M/C2 vs MX118DW
BU8244F-E1 TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO16, SOP-16 ROHM Semiconductor TEA1118M/C2 vs BU8244F-E1
MX128DW Cordless Telephone Scrambler/Descrambler, CMOS, PDSO16, Mx Com Inc TEA1118M/C2 vs MX128DW

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