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Parametric results for: TEA1118M/C2 under Cordless Telephone ICs

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Manufacturer Part Number: tea1118mc2

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	Part Number

TEA1118M/C2

NXP Semiconductors

		Most Relevant		Technical				Compliance		Operating Conditions		Physical									Dimensions			Other
Composite Price	Part Life Cycle Code	Supply Voltage-Nom	Technology	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code

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Obsolete

2.9 V

BIPOLAR

CORDLESS TELEPHONE BASEBAND CIRCUIT

1.4 mA

COMMERCIAL EXTENDED

R-PDSO-G16

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

YES

GULL WING

650 µm

DUAL

4.4 mm

5.2 mm

1.5 mm

NXP SEMICONDUCTORS

SOIC

PLASTIC, SOT-369, SSOP-16

unknown

8542.39.00.01