Part Details for TH50VSF4683AASB by Toshiba America Electronic Components
Overview of TH50VSF4683AASB by Toshiba America Electronic Components
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Applications
Audio and Video Systems
Automotive
Part Details for TH50VSF4683AASB
TH50VSF4683AASB CAD Models
TH50VSF4683AASB Part Data Attributes
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TH50VSF4683AASB
Toshiba America Electronic Components
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Datasheet
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TH50VSF4683AASB
Toshiba America Electronic Components
IC SPECIALTY MEMORY CIRCUIT, PBGA69, 10 X 12 MM, 0.80 MM PITCH, PLASTIC, FBGA-69, Memory IC:Other
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | BGA | |
Package Description | LFBGA, BGA69,10X12,32 | |
Pin Count | 69 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 80 ns | |
Additional Feature | USER CONFIGURABLE AS 8M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 1M X 16 OR 2M X 8 | |
JESD-30 Code | R-PBGA-B69 | |
JESD-609 Code | e0 | |
Length | 12 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Mixed Memory Type | FLASH+SRAM | |
Number of Functions | 1 | |
Number of Terminals | 69 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -30 °C | |
Organization | 4MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA69,10X12,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Current-Max | 0.05 mA | |
Supply Voltage-Max (Vsup) | 3.1 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 10 mm |