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Part Details for TLE94713ESV33XUMA1 by Infineon Technologies AG
Overview of TLE94713ESV33XUMA1 by Infineon Technologies AG
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Applications
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Price & Stock for TLE94713ESV33XUMA1
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
93AC7360
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Newark | System Basis Chip, 150Deg C, Dso-48, Product Range:-, Ic Case/Package:Dso, No. Of Pins:48Pins, Supply Voltage Min:-, Supply Voltage Max:28V, Protocol Supported:Can, Supported Standards:Iso 11898-2, Sae J2284, Output Voltage:3.3V Rohs Compliant: Yes |Infineon TLE94713ESV33XUMA1 Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Cut Tape | 4960 |
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$2.3400 / $4.4400 | Buy Now |
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DISTI #
TLE94713ESV33XUMA1CT-ND
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DigiKey | IC SYST BASIS CHIP TSDSO24-1 Min Qty: 1 Lead time: 52 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
4830 In Stock |
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$2.1414 / $4.2700 | Buy Now |
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DISTI #
TLE94713ESV33XUMA1
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Avnet Americas | Lite CAN System Basic Chip 24-Pin TSDSO T/R - Tape and Reel (Alt: TLE94713ESV33XUMA1) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 53 Weeks, 1 Days Container: Reel | 0 |
|
$2.4709 | Buy Now |
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DISTI #
726-TLE94713ESV33XUM
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Mouser Electronics | CAN Interface IC OPTIREG SYST BASIS CHIPS RoHS: Compliant | 1009 |
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$2.1400 / $4.2700 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 3000 Package Multiple: 3000 Container: Reel | 0Reel |
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$2.0500 | Buy Now |
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DISTI #
TLE94713ESV33XUMA1
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Avnet Americas | Lite CAN System Basic Chip 24-Pin TSDSO T/R - Tape and Reel (Alt: TLE94713ESV33XUMA1) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 53 Weeks, 1 Days Container: Reel | 0 |
|
$2.4709 | Buy Now |
|
DISTI #
TLE94713ESV33XUMA1
|
Avnet Americas | Lite CAN System Basic Chip 24-Pin TSDSO T/R - Tape and Reel (Alt: TLE94713ESV33XUMA1) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 53 Weeks, 1 Days Container: Reel | 0 |
|
$2.4709 | Buy Now |
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Chip Stock | 18000 |
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RFQ | ||
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DISTI #
2986325RL
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element14 Asia-Pacific | SYS BASIS CHIP, AEC-Q100, 3.3V, TSDSO-24 RoHS: Compliant Min Qty: 100 Container: Reel | 4960 |
|
$2.3705 / $3.3686 | Buy Now |
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DISTI #
2986325
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element14 Asia-Pacific | SYS BASIS CHIP, AEC-Q100, 3.3V, TSDSO-24 RoHS: Compliant Min Qty: 1 Container: Cut Tape | 4960 |
|
$2.3705 / $4.5721 | Buy Now |
Part Details for TLE94713ESV33XUMA1
TLE94713ESV33XUMA1 CAD Models
TLE94713ESV33XUMA1 Part Data Attributes
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TLE94713ESV33XUMA1
Infineon Technologies AG
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Datasheet
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TLE94713ESV33XUMA1
Infineon Technologies AG
Power Supply Management Circuit,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | DSO-24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 53 Weeks, 1 Day | |
| Samacsys Manufacturer | Infineon | |
| Adjustable Threshold | YES | |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT | |
| JESD-30 Code | R-PDSO-G24 | |
| JESD-609 Code | e3 | |
| Length | 8.65 mm | |
| Moisture Sensitivity Level | 2A | |
| Number of Channels | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HTSSOP | |
| Package Equivalence Code | TSSOP24,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.15 mm | |
| Supply Current-Max (Isup) | 6.5 mA | |
| Supply Voltage-Max (Vsup) | 28 V | |
| Supply Voltage-Min (Vsup) | 5.5 V | |
| Supply Voltage-Nom (Vsup) | 13.5 V | |
| Surface Mount | YES | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Threshold Voltage-Nom | +0.6V | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 3.9 mm |