| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| TLV274IDRG4 | Texas Instruments | Check for Price | Operational Amplifier, 4 Func, 5000uV Offset-Max, CMOS, PDSO14 | TLV274IDG4 vs TLV274IDRG4 |
Part Details for TLV274IDG4 by Texas Instruments
Results Overview of TLV274IDG4 by Texas Instruments
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 replacement)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (1 option)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
TLV274IDG4 Information
TLV274IDG4 by Texas Instruments is an Operational Amplifier.
Operational Amplifiers are under the broader part category of Amplifier Circuits.
Amplifier circuits use external power to increase the amplitude of an input signal. They can be used to perform linear amplifications or logarithmic functions. Read more about Amplifier Circuits on our Amplifier Circuits part category page.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| TLV274IDG4 | Texas Instruments | 550-uA/Ch 3-MHz Rail-to-Rail Output Operational Amplifiers 14-SOIC -40 to 125 |
Price & Stock for TLV274IDG4
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
TLV274IDG4-ND
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DigiKey | IC OP AMP 4CH 14-SOIC Min Qty: 500 Container: Tube |
0 Tube |
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$0.8010 | Buy Now |
|
|
Vyrian | Operational Amplifier, 4 Func, 7000uV Offset-Max, CMOS, PDSO14 | 7515 |
|
RFQ |
US Tariff Estimator: TLV274IDG4 by Texas Instruments
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
TLV274IDG4 CAD Models
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TLV274IDG4 Part Data Attributes
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TLV274IDG4
Texas Instruments
Buy Now
Datasheet
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TLV274IDG4
Texas Instruments
Operational Amplifier, 4 Func, 5000uV Offset-Max, CMOS, PDSO14
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Part Package Code | SOIC | |
| Package Description | Soic-14 | |
| Pin Count | 14 | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Amplifier Type | Operational Amplifier | |
| Architecture | Voltage-Feedback | |
| Average Bias Current-Max (IIB) | 0.00006 µA | |
| Bias Current-Max (IIB) @25C | 0.00006 µA | |
| Common-mode Reject Ratio-Min | 65 Db | |
| Common-mode Reject Ratio-Nom | 80 Db | |
| Frequency Compensation | Yes | |
| Input Offset Current-Max (IIO) | 0.00006 µA | |
| Input Offset Voltage-Max | 5000 µV | |
| JESD-30 Code | R-PDSO-G14 | |
| JESD-609 Code | e4 | |
| Length | 8.65 Mm | |
| Low-Bias | Yes | |
| Low-Offset | No | |
| Micropower | No | |
| Moisture Sensitivity Level | 1 | |
| Neg Supply Voltage Limit-Max | -8.25 V | |
| Neg Supply Voltage-Nom (Vsup) | -5 V | |
| Number of Functions | 4 | |
| Number of Terminals | 14 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | SOP | |
| Package Equivalence Code | SOP14,.25 | |
| Package Shape | Rectangular | |
| Package Style | Small Outline | |
| Packing Method | Tube | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power | No | |
| Programmable Power | No | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.75 Mm | |
| Slew Rate-Min | 1 V/Us | |
| Slew Rate-Nom | 2.1 V/Us | |
| Supply Current-Max | 2.64 Ma | |
| Supply Voltage Limit-Max | 8.25 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Automotive | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | Gull Wing | |
| Terminal Pitch | 1.27 Mm | |
| Terminal Position | Dual | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Unity Gain BW-Nom | 3000 | |
| Voltage Gain-Min | 70795 | |
| Wideband | No | |
| Width | 3.9 Mm |
Alternate Parts for TLV274IDG4
This table gives cross-reference parts and alternative options found for TLV274IDG4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TLV274IDG4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
TLV274IDG4 Frequently Asked Questions (FAQ)
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The maximum power dissipation of the TLV274IDG4 is dependent on the ambient temperature and the package type. For the SOIC package, the maximum power dissipation is 670mW at 25°C ambient temperature. However, it's recommended to derate the power dissipation to ensure reliable operation.
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To minimize noise and ensure stability, it's recommended to follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and keeping the input and output traces short and away from each other. Additionally, decoupling capacitors should be placed close to the op-amp power pins.
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The recommended decoupling capacitor value is typically in the range of 0.01uF to 0.1uF, with a voltage rating that matches or exceeds the op-amp's supply voltage. A 0.1uF ceramic capacitor is a good starting point, but the optimal value may vary depending on the specific application and PCB layout.
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While the TLV274IDG4 is an op-amp, it can be used as a comparator in certain applications. However, it's not recommended for high-speed or high-frequency comparator applications due to its limited slew rate and bandwidth. Additionally, the op-amp's output stage is not designed for high-current drive, so it may not be suitable for driving heavy loads.
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The TLV274IDG4 has built-in ESD protection, but it's still recommended to follow good ESD handling practices during manufacturing and assembly. This includes using ESD-safe materials, grounding personnel and equipment, and using ESD-protective packaging and storage.