Datasheets
TMM27512AD-250 by: Toshiba America Electronic Components

IC 64K X 8 UVPROM, 250 ns, CDIP28, CERDIP-28, Programmable ROM

Part Details for TMM27512AD-250 by Toshiba America Electronic Components

Overview of TMM27512AD-250 by Toshiba America Electronic Components

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Applications Consumer Electronics Industrial Automation Renewable Energy Robotics and Drones

Part Details for TMM27512AD-250

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TMM27512AD-250 Part Data Attributes:

TMM27512AD-250 Toshiba America Electronic Components
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TMM27512AD-250 Toshiba America Electronic Components IC 64K X 8 UVPROM, 250 ns, CDIP28, CERDIP-28, Programmable ROM
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer TOSHIBA CORP
Part Package Code DIP
Package Description CERDIP-28
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 250 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 524288 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.2 mm
Supply Current-Max 0.13 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for TMM27512AD-250

This table gives cross-reference parts and alternative options found for TMM27512AD-250. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMM27512AD-250, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HN27512G-25 UVPROM, 64KX8, 250ns, CMOS, CDIP28, CERDIP-28 Hitachi Ltd TMM27512AD-250 vs HN27512G-25
M27512-25F6 64KX8 UVPROM, 250ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics TMM27512AD-250 vs M27512-25F6
AM27C512DE UVPROM, 64KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD TMM27512AD-250 vs AM27C512DE
AM27C512-255DE UVPROM, 64KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD TMM27512AD-250 vs AM27C512-255DE
M27C512-25F1 64KX8 UVPROM, 250ns, CDIP28, CERAMIC, DIP-28 STMicroelectronics TMM27512AD-250 vs M27C512-25F1
AM27C512-250/BXA UVPROM, 64KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD TMM27512AD-250 vs AM27C512-250/BXA
TMS27C512-25JL 524 288-Bit Programmable Read-Only Memory 28-CDIP 0 to 70 Texas Instruments TMM27512AD-250 vs TMS27C512-25JL
QD27C513-250V10 UVPROM, 64KX8, 250ns, CMOS, CDIP28, CERDIP-28 Intel Corporation TMM27512AD-250 vs QD27C513-250V10
AM27C512-255DCB UVPROM, 64KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 Spansion TMM27512AD-250 vs AM27C512-255DCB
M27C512-25F6 64KX8 UVPROM, 250ns, CDIP28, CERAMIC, DIP-28 STMicroelectronics TMM27512AD-250 vs M27C512-25F6
Part Number Description Manufacturer Compare
M27512F1 64KX8 UVPROM, 250ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics TMM27512AD-250 vs M27512F1
TMS27C512JL4 64KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 Texas Instruments TMM27512AD-250 vs TMS27C512JL4
AM27C512L-255DCB UVPROM, 64KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD TMM27512AD-250 vs AM27C512L-255DCB
TMS27C512-25JL4 64KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments TMM27512AD-250 vs TMS27C512-25JL4
AM27512-25DEB UVPROM, 64KX8, 250ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD TMM27512AD-250 vs AM27512-25DEB
M27512-25F6 64KX8 UVPROM, 250ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics TMM27512AD-250 vs M27512-25F6
QD27C513-250V10 UVPROM, 64KX8, 250ns, CMOS, CDIP28, CERDIP-28 Intel Corporation TMM27512AD-250 vs QD27C513-250V10
TMS27C512-25JL 524 288-Bit Programmable Read-Only Memory 28-CDIP 0 to 70 Texas Instruments TMM27512AD-250 vs TMS27C512-25JL
TMM27512ADI-25 IC 64K X 8 UVPROM, 250 ns, CDIP28, CERDIP-28, Programmable ROM Toshiba America Electronic Components TMM27512AD-250 vs TMM27512ADI-25
NMC27C512AQM250 IC 64K X 8 UVPROM, 250 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation TMM27512AD-250 vs NMC27C512AQM250

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