Part Details for TMS320C6711BGFN150 by Rochester Electronics LLC
Overview of TMS320C6711BGFN150 by Rochester Electronics LLC
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Part Details for TMS320C6711BGFN150
TMS320C6711BGFN150 CAD Models
TMS320C6711BGFN150 Part Data Attributes
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TMS320C6711BGFN150
Rochester Electronics LLC
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Datasheet
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TMS320C6711BGFN150
Rochester Electronics LLC
32-BIT, 149.25MHz, OTHER DSP, PBGA256, 27 X 27 MM, PLASTIC, BGA-256
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | BGA | |
| Package Description | 27 X 27 MM, PLASTIC, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | unknown | |
| Additional Feature | ALSO REQUIRES 3.3V SUPPLY | |
| Address Bus Width | 22 | |
| Barrel Shifter | NO | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 149.25 MHz | |
| External Data Bus Width | 32 | |
| Format | FLOATING POINT | |
| Internal Bus Architecture | MULTIPLE | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e0 | |
| Length | 27 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 220 | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 2.32 mm | |
| Supply Voltage-Max | 2 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 1.9 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 27 mm | |
| uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |