Part Details for TMS320DM355DZCEA13 by Texas Instruments
Results Overview of TMS320DM355DZCEA13 by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TMS320DM355DZCEA13 Information
TMS320DM355DZCEA13 by Texas Instruments is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for TMS320DM355DZCEA13
| Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Microprocessor Circuit, CMOS, PBGA337 | 8244 |
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RFQ |
US Tariff Estimator: TMS320DM355DZCEA13 by Texas Instruments
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
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TMS320DM355DZCEA13 Part Data Attributes
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TMS320DM355DZCEA13
Texas Instruments
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TMS320DM355DZCEA13
Texas Instruments
TMS320DM355DZCEA13
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Part Package Code | BGA | |
| Package Description | 13 X 13 Mm, 0.65 Mm Pitch, Rohs Compliant, Plastic, Nfbga-337 | |
| Pin Count | 337 | |
| HTS Code | 8542.31.00.30 | |
| Additional Feature | It Also Operates At 1.8v And 3.3v Supply For I/O | |
| Bit Size | 32 | |
| Format | Fixed Point | |
| JESD-30 Code | S-PBGA-B337 | |
| JESD-609 Code | e1 | |
| Length | 13 Mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 337 | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA337,19X19,25 | |
| Package Shape | Square | |
| Package Style | Grid Array, Low Profile, Fine Pitch | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 8192 | |
| Seated Height-Max | 1.3 Mm | |
| Supply Voltage-Max | 1.365 V | |
| Supply Voltage-Min | 1.235 V | |
| Supply Voltage-Nom | 1.3 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | Ball | |
| Terminal Pitch | 0.65 Mm | |
| Terminal Position | Bottom | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 13 Mm | |
| uPs/uCs/Peripheral ICs Type | Digital Media Soc |