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TMS320DM369ZCED by: Texas Instruments

CMOS, PBGA338

Part Details for TMS320DM369ZCED by Texas Instruments

Results Overview of TMS320DM369ZCED by Texas Instruments

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Applications Security and Surveillance

TMS320DM369ZCED Information

TMS320DM369ZCED by Texas Instruments is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for TMS320DM369ZCED

Part # Distributor Description Stock Price Buy
DISTI # 595-TMS320DM369ZCED
Mouser Electronics Digital Signal Processors & Controllers - DSP, DSC Digital Media SoC RoHS: Compliant 0
  • 160 $45.9100
$45.9100 Order Now
Chip Stock DaVinci Digital Media Processor 338-NFBGA -40 to 85 2670
RFQ
Vyrian Microprocessor Circuit, CMOS, PBGA338 4257
RFQ

US Tariff Estimator: TMS320DM369ZCED by Texas Instruments

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TMS320DM369ZCED
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Part Details for TMS320DM369ZCED

TMS320DM369ZCED CAD Models

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TMS320DM369ZCED Part Data Attributes

TMS320DM369ZCED Texas Instruments
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TMS320DM369ZCED Texas Instruments CMOS, PBGA338
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
ECCN Code 3A991.A.2
HTS Code 8542.31.00.35
Bit Size 32
Bus Compatibility Ethernet; I2c; Spi; Uart; Usb
External Data Bus Width 32
Format Fixed Point
JESD-30 Code S-PBGA-B338
JESD-609 Code e1
Length 13 Mm
Moisture Sensitivity Level 3
Number of Terminals 338
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material Plastic/Epoxy
Package Code LFBGA
Package Equivalence Code BGA338,19X19,25
Package Shape Square
Package Style Grid Array, Low Profile, Fine Pitch
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (words) 32768
Seated Height-Max 1.3 Mm
Surface Mount Yes
Technology Cmos
Temperature Grade Industrial
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form Ball
Terminal Pitch 0.65 Mm
Terminal Position Bottom
Time@Peak Reflow Temperature-Max (s) 30
Width 13 Mm
uPs/uCs/Peripheral ICs Type Digital Media Soc

Alternate Parts for TMS320DM369ZCED

This table gives cross-reference parts and alternative options found for TMS320DM369ZCED. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TMS320DM369ZCED, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
TMS320DM369ZCE Texas Instruments $21.2587 CMOS, PBGA338 TMS320DM369ZCED vs TMS320DM369ZCE
equivalents icon

TMS320DM369ZCED Related Parts

TMS320DM369ZCED Frequently Asked Questions (FAQ)

  • The recommended power-on sequence is to power up the core voltage (VDD_CORE) first, followed by the I/O voltage (VDD_IO). This ensures that the internal voltage regulators are properly enabled and the device boots up correctly.

  • To optimize the DDR2 memory interface, ensure that the memory clock frequency is set to the maximum supported frequency (166 MHz), and use the recommended timing parameters for the specific DDR2 memory module being used. Additionally, implement proper signal integrity and routing guidelines to minimize signal degradation.

  • The DM369's VPU supports up to 1080p resolution at 60 frames per second (fps) for H.264 and MPEG-4 encoding and decoding. For JPEG encoding and decoding, the maximum resolution is 4224x3168 at 30 fps.

  • Implement a reliable and efficient boot process by using a boot loader that can handle different boot modes (e.g., NAND, NOR, UART), and ensure that the boot loader is configured to correctly initialize the device's peripherals and memory interfaces. Additionally, use a secure boot mechanism to prevent unauthorized access to the device.

  • The DM369 has a maximum junction temperature (TJ) of 90°C. To ensure reliable operation, implement proper thermal management techniques such as heat sinks, thermal interfaces, and airflow management. Monitor the device's temperature using the on-chip temperature sensor and adjust the system design accordingly.

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