Part Details for TMS320VC5416ZGU160 by Texas Instruments
Overview of TMS320VC5416ZGU160 by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for TMS320VC5416ZGU160
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Bristol Electronics | 2 |
|
RFQ | ||
|
Quest Components | 16-BIT, 20MHZ, OTHER DSP, PBGA144 | 1 |
|
$6.0000 | Buy Now |
|
Quest Components | 16-BIT, 20MHZ, OTHER DSP, PBGA144 | 1 |
|
$59.7600 | Buy Now |
Part Details for TMS320VC5416ZGU160
TMS320VC5416ZGU160 CAD Models
TMS320VC5416ZGU160 Part Data Attributes
|
TMS320VC5416ZGU160
Texas Instruments
Buy Now
Datasheet
|
Compare Parts:
TMS320VC5416ZGU160
Texas Instruments
Digital Signal Processor 144-BGA MICROSTAR 0 to 0
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | LFBGA, BGA144,13X13,32 | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO REQUIRES 3.3V SUPPLY | |
Address Bus Width | 23 | |
Barrel Shifter | YES | |
Bit Size | 16 | |
Boundary Scan | YES | |
Clock Frequency-Max | 20 MHz | |
External Data Bus Width | 16 | |
Format | FIXED POINT | |
Integrated Cache | NO | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PBGA-B144 | |
JESD-609 Code | e1 | |
Length | 12 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 6 | |
Number of External Interrupts | 4 | |
Number of Terminals | 144 | |
Number of Timers | 1 | |
On Chip Data RAM Width | 16 | |
On Chip Program ROM Width | 16 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA144,13X13,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (words) | 131072 | |
ROM Programmability | MROM | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max | 1.65 V | |
Supply Voltage-Min | 1.55 V | |
Supply Voltage-Nom | 1.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 12 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |