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TNETV2666FIDZWT by: Texas Instruments

Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 30MHz, CMOS, PBGA361

Part Details for TNETV2666FIDZWT by Texas Instruments

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TNETV2666FIDZWT Information

TNETV2666FIDZWT by Texas Instruments is a Digital Signal Processor.
Digital Signal Processors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
TNETV2666FIDZWT Texas Instruments Fixed-Point Digital Signal Processor 361-NFBGA 0 to 0

Price & Stock for TNETV2666FIDZWT

Part # Distributor Description Stock Price Buy
DISTI # TNETV2666FIDZWT-ND
DigiKey DAVINCI DIGITAL MEDIA SYSTEM-ON- Min Qty: 90 Container: Tray 0
Tray
  • 90 $57.9826
$57.9826 Buy Now
DISTI # 595-TNETV2666FIDZWT
Mouser Electronics Digital Signal Processors & Controllers - DSP, DSC C64x+ fixed point DS P- up to 600MHz 16/ A 595-TMS320C6424ZWT6 RoHS: Compliant 0
  • 90 $57.7900
$57.7900 Order Now

US Tariff Estimator: TNETV2666FIDZWT by Texas Instruments

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Part Details for TNETV2666FIDZWT

TNETV2666FIDZWT CAD Models

TNETV2666FIDZWT Part Data Attributes

TNETV2666FIDZWT Texas Instruments
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TNETV2666FIDZWT Texas Instruments Digital Signal Processor, 32-Bit Size, 32-Ext Bit, 30MHz, CMOS, PBGA361
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Part Package Code BGA
Pin Count 361
ECCN Code 3A991.a.2
HTS Code 8542.31.00.35
Address Bus Width 13
Barrel Shifter No
Bit Size 32
Boundary Scan Yes
Clock Frequency-Max 30 Mhz
External Data Bus Width 32
Format Fixed Point
Internal Bus Architecture Multiple
JESD-30 Code S-PBGA-B361
JESD-609 Code e1
Length 16 Mm
Low Power Mode Yes
Moisture Sensitivity Level 3
Number of Terminals 361
Operating Temperature-Max 90 °C
Operating Temperature-Min
Package Body Material Plastic/Epoxy
Package Code LFBGA
Package Shape Square
Package Style Grid Array, Low Profile, Fine Pitch
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.4 Mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount Yes
Technology Cmos
Temperature Grade Other
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form Ball
Terminal Pitch 0.8 Mm
Terminal Position Bottom
Time@Peak Reflow Temperature-Max (s) 30
Width 16 Mm
uPs/uCs/Peripheral ICs Type Digital Signal Processor, Other
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