Part Details for TSXC750AMGU/T8LH by Thales Group
Overview of TSXC750AMGU/T8LH by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSXC750AMGU/T8LH
TSXC750AMGU/T8LH CAD Models
TSXC750AMGU/T8LH Part Data Attributes
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TSXC750AMGU/T8LH
Thales Group
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Datasheet
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TSXC750AMGU/T8LH
Thales Group
RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | , | |
Pin Count | 360 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 83.3 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B360 | |
Low Power Mode | YES | |
Number of Terminals | 360 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Speed | 200 MHz | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.5 V | |
Supply Voltage-Nom | 2.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXC750AMGU/T8LH
This table gives cross-reference parts and alternative options found for TSXC750AMGU/T8LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXC750AMGU/T8LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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XPC755BPX350LD | 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Freescale Semiconductor | TSXC750AMGU/T8LH vs XPC755BPX350LD |
PC7400VGU350LX | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | TSXC750AMGU/T8LH vs PC7400VGU350LX |
PC7447VGU500NB | RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Teledyne e2v | TSXC750AMGU/T8LH vs PC7447VGU500NB |
PPC7448HX667NC | 32-BIT, 667MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | TSXC750AMGU/T8LH vs PPC7448HX667NC |
PCX7448MLH1000ND | RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, LGA-360 | Teledyne e2v | TSXC750AMGU/T8LH vs PCX7448MLH1000ND |
PPC7448HX1250NC | 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 | Freescale Semiconductor | TSXC750AMGU/T8LH vs PPC7448HX1250NC |
PCX7448VSH1267ND | RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, CERAMIC, ROHS COMPLIANT, BGA-360 | Teledyne e2v | TSXC750AMGU/T8LH vs PCX7448VSH1267ND |
IBM25EMPPC750LFBE3000 | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | TSXC750AMGU/T8LH vs IBM25EMPPC750LFBE3000 |
TSPC750AVGB/Q12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSXC750AMGU/T8LH vs TSPC750AVGB/Q12LE |
TSXPC750AMGSB/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSXC750AMGU/T8LH vs TSXPC750AMGSB/T12LE |