Datasheets
TSXC750AVG12LH by: Thales Group

RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360

Part Details for TSXC750AVG12LH by Thales Group

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Part Details for TSXC750AVG12LH

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TSXC750AVG12LH Part Data Attributes

TSXC750AVG12LH Thales Group
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TSXC750AVG12LH Thales Group RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360
Part Life Cycle Code Obsolete
Ihs Manufacturer THOMSON-CSF SEMICONDUCTORS
Part Package Code BGA
Package Description ,
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 83.3 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Low Power Mode YES
Number of Terminals 360
Operating Temperature-Max 110 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Speed 266 MHz
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.5 V
Supply Voltage-Nom 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Position BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for TSXC750AVG12LH

This table gives cross-reference parts and alternative options found for TSXC750AVG12LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXC750AVG12LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSXC750AVGB/Q10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSXC750AVG12LH vs TSXC750AVGB/Q10LH
IBM25EMPPC750DBUB2330 RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM TSXC750AVG12LH vs IBM25EMPPC750DBUB2330
TSPC750AMGU10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 e2v technologies TSXC750AVG12LH vs TSPC750AMGU10LE
MPC755BPX350RD RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, PLASTIC, BGA-360 Motorola Semiconductor Products TSXC750AVG12LH vs MPC755BPX350RD
PCX7410MGHU450LE RISC Microprocessor, 32-Bit, 450MHz, CMOS, CBGA360, HITCE, CERAMIC, BGA-360 Atmel Corporation TSXC750AVG12LH vs PCX7410MGHU450LE
TSPC750AMGB/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSXC750AVG12LH vs TSPC750AMGB/T10LH
PC750PVGSU300LE RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, CICGA-360 Atmel Corporation TSXC750AVG12LH vs PC750PVGSU300LE
PC7447MGU1050LB RISC Microprocessor, 32-Bit, 1050MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSXC750AVG12LH vs PC7447MGU1050LB
PC7447VGU650LB RISC Microprocessor, 32-Bit, 650MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation TSXC750AVG12LH vs PC7447VGU650LB
PPC7448HX1400NC 32-BIT, 1400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor TSXC750AVG12LH vs PPC7448HX1400NC

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