Part Details for U630H04D1C25G1 by Cypress Semiconductor
Overview of U630H04D1C25G1 by Cypress Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
Energy and Power Systems
Part Details for U630H04D1C25G1
U630H04D1C25G1 CAD Models
U630H04D1C25G1 Part Data Attributes:
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U630H04D1C25G1
Cypress Semiconductor
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Datasheet
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U630H04D1C25G1
Cypress Semiconductor
512X8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28
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| Pbfree Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SIMTEK CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 25 ns | |
| JESD-30 Code | R-PDIP-T28 | |
| JESD-609 Code | e3 | |
| Length | 37.1 mm | |
| Memory Density | 4096 bit | |
| Memory IC Type | NON-VOLATILE SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 512 words | |
| Number of Words Code | 512 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512X8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.1 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 15.24 mm |
Alternate Parts for U630H04D1C25G1
This table gives cross-reference parts and alternative options found for U630H04D1C25G1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of U630H04D1C25G1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| U630H04D1C25 | Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | ZMDI | U630H04D1C25G1 vs U630H04D1C25 |
| U630H04D1C25 | 512X8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Cypress Semiconductor | U630H04D1C25G1 vs U630H04D1C25 |
| U630H04D1C25G1 | Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | ZMDI | U630H04D1C25G1 vs U630H04D1C25G1 |
| U630H04D1C25 | Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Simtek Corporation | U630H04D1C25G1 vs U630H04D1C25 |
| U630H04D1C25G1 | Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Simtek Corporation | U630H04D1C25G1 vs U630H04D1C25G1 |