Part Details for UPD44164362BF5-E40-EQ3 by Renesas Electronics Corporation
Overview of UPD44164362BF5-E40-EQ3 by Renesas Electronics Corporation
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for UPD44164362BF5-E40-EQ3
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-UPD44164362BF5-E40-EQ3-ND
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DigiKey | DDR SRAM, 512KX36, 0.45NS Min Qty: 8 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
21564 In Stock |
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$40.2700 | Buy Now |
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DISTI #
UPD44164362BF5-E40
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Avnet Americas | - Bulk (Alt: UPD44164362BF5-E40) RoHS: Not Compliant Min Qty: 9 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Bulk | 21564 Partner Stock |
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$32.9100 / $40.6600 | Buy Now |
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Rochester Electronics | DDR SRAM, 512KX36, 0.45ns ' RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 21564 |
|
$34.5600 / $40.6600 | Buy Now |
Part Details for UPD44164362BF5-E40-EQ3
UPD44164362BF5-E40-EQ3 CAD Models
UPD44164362BF5-E40-EQ3 Part Data Attributes
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UPD44164362BF5-E40-EQ3
Renesas Electronics Corporation
Buy Now
Datasheet
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Compare Parts:
UPD44164362BF5-E40-EQ3
Renesas Electronics Corporation
512K X 36 DDR SRAM, 0.45 ns, PBGA165, 13 X 15 MM, PLASTIC, BGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | 13 X 15 MM, PLASTIC, BGA-165 | |
| Pin Count | 165 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 4 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 15 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Seated Height-Max | 1.46 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm |