Datasheets
UPD44324094F5-E33-EQ2 by: NEC Electronics Group

DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, FBGA-165

Part Details for UPD44324094F5-E33-EQ2 by NEC Electronics Group

Overview of UPD44324094F5-E33-EQ2 by NEC Electronics Group

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Applications Industrial Automation Renewable Energy Robotics and Drones

Part Details for UPD44324094F5-E33-EQ2

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UPD44324094F5-E33-EQ2 Part Data Attributes:

UPD44324094F5-E33-EQ2 NEC Electronics Group
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UPD44324094F5-E33-EQ2 NEC Electronics Group DDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, FBGA-165
Part Life Cycle Code Obsolete
Ihs Manufacturer NEC ELECTRONICS CORP
Part Package Code BGA
Package Description BGA,
Pin Count 165
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165
Length 15 mm
Memory Density 37748736 bit
Memory IC Type DDR SRAM
Memory Width 9
Number of Functions 1
Number of Terminals 165
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4MX9
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

Alternate Parts for UPD44324094F5-E33-EQ2

This table gives cross-reference parts and alternative options found for UPD44324094F5-E33-EQ2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UPD44324094F5-E33-EQ2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IS61QDPB24M18A-300M3LI QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc UPD44324094F5-E33-EQ2 vs IS61QDPB24M18A-300M3LI
GS8672D19BE-375T Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology UPD44324094F5-E33-EQ2 vs GS8672D19BE-375T
GS8662DT20BGD-500I QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology UPD44324094F5-E33-EQ2 vs GS8662DT20BGD-500I
GS8662S18BGD-350 Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 GSI Technology UPD44324094F5-E33-EQ2 vs GS8662S18BGD-350
GS81302Q19E-333I QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology UPD44324094F5-E33-EQ2 vs GS81302Q19E-333I
IS61QDB44M18A-400B4LI QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc UPD44324094F5-E33-EQ2 vs IS61QDB44M18A-400B4LI
IS61QDP2B24M18A-300M3L QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc UPD44324094F5-E33-EQ2 vs IS61QDP2B24M18A-300M3L
CY7C1426V18-250BZC QDR SRAM, 4MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165 Cypress Semiconductor UPD44324094F5-E33-EQ2 vs CY7C1426V18-250BZC
IS61QDP2B44M18A-333M3I QDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc UPD44324094F5-E33-EQ2 vs IS61QDP2B44M18A-333M3I
IS61DDB44M18A-300B4 DDR SRAM, 4MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc UPD44324094F5-E33-EQ2 vs IS61DDB44M18A-300B4

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