Part Details for UPD44324185F5-E50-EQ2-A by Renesas Electronics Corporation
Overview of UPD44324185F5-E50-EQ2-A by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for UPD44324185F5-E50-EQ2-A
UPD44324185F5-E50-EQ2-A CAD Models
UPD44324185F5-E50-EQ2-A Part Data Attributes:
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UPD44324185F5-E50-EQ2-A
Renesas Electronics Corporation
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UPD44324185F5-E50-EQ2-A
Renesas Electronics Corporation
2MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, FBGA-165
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.51 mm | |
| Standby Current-Max | 0.4 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.75 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm |
Alternate Parts for UPD44324185F5-E50-EQ2-A
This table gives cross-reference parts and alternative options found for UPD44324185F5-E50-EQ2-A. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UPD44324185F5-E50-EQ2-A, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1423AV18-200BZXC | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | UPD44324185F5-E50-EQ2-A vs CY7C1423AV18-200BZXC |
| GS8342S18AGE-250IT | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 | GSI Technology | UPD44324185F5-E50-EQ2-A vs GS8342S18AGE-250IT |
| CY7C1423AV18-250BZXI | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | UPD44324185F5-E50-EQ2-A vs CY7C1423AV18-250BZXI |
| UPD44324185F5-E40Y-EQ2-A | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, FBGA-165 | NEC Electronics Group | UPD44324185F5-E50-EQ2-A vs UPD44324185F5-E40Y-EQ2-A |
| UPD44324185F5-E50Y-EQ2-A | 2MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, FBGA-165 | Renesas Electronics Corporation | UPD44324185F5-E50-EQ2-A vs UPD44324185F5-E50Y-EQ2-A |
| CY7C1423BV18-250BZXC | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | UPD44324185F5-E50-EQ2-A vs CY7C1423BV18-250BZXC |
| GS8342S18AE-250I | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165 | GSI Technology | UPD44324185F5-E50-EQ2-A vs GS8342S18AE-250I |
| UPD44324185F5-E40-EQ2 | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, FBGA-165 | NEC Electronics Group | UPD44324185F5-E50-EQ2-A vs UPD44324185F5-E40-EQ2 |
| GS8342S18AGE-200T | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 | GSI Technology | UPD44324185F5-E50-EQ2-A vs GS8342S18AGE-200T |
| GS8342S18AE-200I | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165 | GSI Technology | UPD44324185F5-E50-EQ2-A vs GS8342S18AE-200I |